The present invention improves the handling properties of a rubber-only gasket and the affixability thereof to an attachment position. To this end, the provided gasket is: obtained by combining a gasket body of the rubber-only type, and a carrier sheet that comprises a resin film and holds the gasket body in an un-adhered state; and characterized in that the gasket body is provided with an adhesive section or bonding section for adhering or bonding the gasket body to an attachment position when attaching the gasket body to the attachment position. The adhesive section or bonding section is prepared by providing the lateral surface of the gasket body with a projecting section, and coating the surface of the projecting section with an adhesive or bonding agent. The gasket body is to be used as a gasket for a fuel cell to be incorporated into a fuel cell stack.

The invention provides a gasket which improves a handling workability of a rubber only type gasket. The gasket of the invention is constructed by a combination of a rubber only type gasket main body, and a carrier sheet which is made of a resin film retaining the gasket main body in a non-bonded state, and the carrier sheet is provided with an air inflow port for making air flow into a portion between the carrier sheet and the gasket main body when the gasket main body is detached from the carrier sheet. A gasket retention portion having a three-dimensional shape which is deformed along an outer shape of the gasket main body is arranged at a position which laps over the gasket main body in a plane in the carrier sheet, and the gasket main body is partly accommodated within the gasket retention portion in a thickness direction.

A method for in-mold transferring of electronics from a film includes creating an electronics layer including both active and passive components connected to conductive inks defining electrical traces and electrical contacts. At least one light source is electrically mounted on the conductive inks. A connector is mounted on the conductive inks using a conductive adhesive on the connector. A decorative film structure is connected to the electronics layer having a protective coating covering a graphics printed film. A carrier film is releasably coupled to the protective coating of the decorative film structure with a release agent. The decorative film structure and the electronics layer are placed into an injection mold. A polymeric material is injected into the injection mold encasing the decorative film structure and the electronics layer, with the polymeric material contacting a portion of the carrier film. The carrier film is then removed.

In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

The purpose of the present invention is to improve the handling and usability of rubber only-type gaskets. To achieve said purpose, a gasket molding is obtained by combining a rubber only-type gasket body with a film carrier obtained from a resin film that holds the gasket body in an unbonded state. The gasket molding is characterized in that: in addition to a gasket-holding section for holding the gasket body, the film carrier has temporary tacking sections that are surface-treated to temporarily tack the gasket body to said film carrier; the gasket body has temporary tack-receiving sections that are temporarily tacked to the temporary tacking sections; and the temporary tacking sections and temporary tack-receiving sections are removed from the film carrier and the gasket body when the film carrier and gasket body are punched into the product shapes.

The purpose of this invention is to make it easy to handle all-rubber gaskets. To achieve this purpose, a gasket is characterized in that a gasket body of only rubber is combined with a carrier film that is made from a resin film to hold the gasket body in a non-adhesive state. A three-dimensional portion having a shape that is deformed along the external shape of the gasket body is provided at a position where the gasket body and a plane of the carrier film overlap, and a portion of the gasket body is contained in the three-dimensional section. The gasket body is used as a gasket for fuel cells incorporated into a fuel cell stack.

In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

A body (1, 1, 1) produced by an in-mold process has a first film (2, 2, 2) with at least one electrical or electronic functional layer (25). In a functional area (20a, 20a, 20a) of this functional layer, at least one electrical or electronic component is provided, and at least one electrical connection for this is provided in a contact area (20b, 20b, 20b). The first film is partially back-injection molded with a plastic main material (3, 3, 3) such that the contact area (20b, 20b, 20b) is at least partially free from this plastic main material (3). Suitable formation of the first film (2, 2, 2) guarantees that a tab (F) separated from the plastic main material (3, 3, 3) is provided which adjoins a back-injection molded part of the first film in an area of surface (20c, 20c, 20c) of the body which is at a distance from an edge (31, 31) of the body delimiting the surface (30) with the first film.

A method of manufacturing an artificial eye for fitting as a whole or partial replacement of a patient's original eye. This is done by providing an image of an iris on a substrate (100, 300) comprising at least a frontal region of an artificial eye, providing a support (108, 308) for the substrate, positioning the substrate and support in a mould (122, 322), and encapsulating the substrate within a mould material (136, 336).

A method includes providing a mold defining a mold cavity for receiving material to be molded into a molded part, positioning an insert at least partially in the mold such that a portion of the insert defines a portion of the mold cavity, and injecting the material into the mold cavity to substantially fill the mold cavity to form the molded part. The molded par can then be removed from the mold and the insert can be removed from the molded part. The mold can include silicone and the insert can include polyoxymethylene.