An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.

Disclosed is a textile-like in-mold sheet that is to be integrated with a resin molded body molded by injection of a molten resin by in-molding. The textile-like in-mold sheet includes at least a fiber sheet layer, a first adhesive layer, and a textile material layer, in this order from a surface that will serve as a side to be integrated with the resin molded body. Alternatively, the textile-like in-mold sheet includes at least a textile material layer and a temporary surface protection layer temporarily bonded to the textile material layer, in this order from the surface to be integrated with the resin molded body.

A method for manufacturing an element for a bodywork part successively including the steps of producing a support element having a first face on which a support sheet is fixed having at least one connection member, arranging a heating track on the support element, the heating track being arranged on the first face of the support element, connecting the heating track to the connection member, and arranging the support element in a molding chamber of a mold defining the shape of the element for a bodywork part, the first face of the support element facing the inside of the molding chamber, and injecting a plastic material into the molding chamber in order to cover the heating track.

An insert-molded container in which a secondary container made of transparent synthetic resin is integrally provided to the outside of a primary container, the secondary container includes a gate mark, and a vapor-deposited layer is provided on the outer surface of the primary container in a peripheral area of the gate mark is manufactured by a manufacturing method of insert-molded container. The method includes: a cover attaching step of attaching a cover member made of transparent synthetic resin to the outer surface of a part of the primary container where a vapor-deposited layer is provided; a placing step of placing the primary container in a mold with the cover member facing a gate; and an insert molding step of injecting a transparent synthetic resin material from the gate.

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

An injection mold for encapsulating a substrate comprises a lower mold component and an upper mold component adapted to form an encapsulation mold at an edge of the substrate when the upper mold component engages the lower mold component. The lower mold component comprises a substrate support and wherein the upper mold component comprises a recess. The injection mold includes a tiltable insert sized and shaped to slide within the recess to form a seal for the encapsulation mold, the insert having a substrate-contacting surface defining an area of the substrate contacted by the insert. The injection mold includes a plurality of pressure-exerting actuators connected to the tiltable insert and each being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface.

The invention relates to a film body, a method for the back-injection molding of a film body and a back-injection molding tool therefor. In particular, the invention relates to a method for the back-injection molding of layer electrodes (1) for producing touch-sensitive sensors for example for touch screens. Parts of the layer electrode (1), which after the back-injection molding should still be able to move freely, are covered by a sacrificial film (3) before and during the back-injection molding.

An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.

An objective of the present invention is to provide an organic glass laminate that exhibits excellent weathering resistance and abrasion resistance, and that can be used as an exterior member. This organic glass laminate comprises at least the following, in order: an organic glass base, a cured layer formed from the cured product of a resin composition, which comprises a curable resin and a UV absorber agent; and an inorganic oxide film. The glass transition temperature of the cured product which constitutes the cured layer is adjusted to 80-160 C., and the thickness of the inorganic oxide film is set to at least 0.01 m and less than 0.5 m, whereby weathering resistance and abrasion resistance are significantly improved, and the organic glass laminate is made suitable for use as an exterior member.