A resin molded article has an internal space. The resin molded article includes: a ventilation passage defined to allow the internal space to communicate with an outside of the resin molded article. The ventilation passage includes: a first ventilation passage extending from the internal space in a predetermined direction so as to include a bottom portion; and a second ventilation passage extending from the outside in a direction intersecting the predetermined direction. The first ventilation passage and the second ventilation passage communicate with each other by allowing the bottom portion to communicate with the bifurcated portions provided at an end portion of the second ventilation passage. A portion where the first ventilation passage and the second ventilation passage communicate with each other is narrowest in the ventilation passage.

A mold and molding process for a first shot body member includes a pair of side walls, a semi-circular sleeve positioned between the pair of side walls to define a portion of a longitudinal pocket, and a pair of deflecting wings. Each deflecting wing is coupled to one of the side walls at a corner. A second shot isolation member of an elastically resilient second material is bonded to portions of an interior surface of the longitudinal pocket defined by each of: the semi-circular sleeve, each of the pair of side walls, each of the pair of corners, and each of the pair of wings. Mold members can include supporting surfaces to support interior and exterior portions of the wing during the second shot molding operation, while leaving an exposed interior bonding surface that defines a portion of the second shot molding cavity.

An improved molding process for molding weighing funnels. The molding process involves forming one or more mold cavities wherein each mold cavity comprises an upper cavity portion in an upper mold section and a lower cavity portion in a lower mold section. A two piece core comprising an upper core and lower core are positioned in close proximity to one another. The lower molding section is moved upward to place it in close proximity to the upper molding section to form a mold cavity while the lower core is simultaneously moved into the mold cavity into close proximity with the upper core. Plastic is injected into the mold cavity using hot runner technology to form a weighing funnel. After the weighing funnel is formed, the lower molding section is moved downward while the lower core is simultaneously retracted from the mold cavity. A robotic arm is used to remove finished product from the mold.

A gate is disposed so as to be opened to a cavity portion for forming a plate body part for forming a fuel injection device nozzle plate, and the cavity portion forms a portion surrounded by a plurality of nozzle holes. There are no differences in the times required for the molten resin injected from the gate into the cavity to reach portions for forming the plurality of nozzle holes. As a result, a molding failure of the nozzle holes and the vicinity thereof caused by differences in the charge speeds of molten resin can be prevented and the shapes of the nozzle holes and the vicinity thereof can be formed accurately.

Methods and systems for processing a first solution on a respective primary area of a device with a plurality of primary areas and a plurality of secondary areas are described. A method includes providing the device and dispensing a second solution to a respective secondary area of one or more secondary areas adjacent to the respective primary area, thereby mixing the first solution on the respective secondary area and the second solution on the respective primary area. The method also includes removing at least a portion of the mixed solution.

A method includes providing a mold defining a mold cavity for receiving material to be molded into a molded part, positioning an insert at least partially in the mold such that a portion of the insert defines a portion of the mold cavity, and injecting the material into the mold cavity to substantially fill the mold cavity to form the molded part. The molded par can then be removed from the mold and the insert can be removed from the molded part. The mold can include silicone and the insert can include polyoxymethylene.

The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.

A first shot body member includes a pair of side walls, a semi-circular sleeve positioned between the pair of side walls to define a portion of a longitudinal pocket, and a pair of deflecting wings. Each deflecting wing is coupled to one of the side walls at a corner. A second shot isolation member of an elastically resilient second material is bonded to portions of an interior surface of the longitudinal pocket defined by each of: the semi-circular sleeve, each of the pair of side walls, each of the pair of corners, and each of the pair of wings. Mold members can include supporting surfaces to support interior and exterior portions of the wing during the second shot molding operation, while leaving an exposed interior bonding surface that defines a portion of the second shot molding cavity. Related methods are further disclosed.

A thin type injection molding skin manufacturing apparatus in which a mold movable part moves to be separated from a mold fixing part at a time of taking out a skin to open a mold, may include a holder part cavity for molding a holder part formed integrally with the skin, which is formed inside the mold fixing part and a fixing part slider capable of elastically pressing the holder part molded in the holder part cavity installed on the end of the holder part cavity, and as a result, the fixing part slider presses and holds the holder part molded integrally with the skin when the mold movable part moves to be separated from the mold fixing part.

A semiconductor die encapsulation or carrier-mounting method and apparatus for manufacturing a semiconductor product, wherein a first tool part for holding multiple semiconductor dies is provided and the semiconductor dies are placed on the first tool part, one of the first and a second tool part including displaceable insert members applying a pressure by each displaceable insert member on a surface area of the semiconductor die, and the first and second tool parts are brought together to define a space between the first and second tool parts with the semiconductor products being arranged within the space. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure, and subsequently, the first and second tool parts are separated and the processed semiconductor dies removed.