Patent classifications
B29C45/74
INJECTION MOLDING SYSTEM AND METHOD FOR MANUFACTURING MOLDED OBJECT
An injection molding system includes: an injection molding machine; an inspection device including a first placement unit, a second placement unit, an inspection unit, and a moving unit configured to change a relative position between the first placement unit and the inspection unit and a relative position between the second placement unit and the inspection unit; a third placement unit; a robot configured to convey the molded object; and a control device. The control device controls the injection molding machine, the robot, and the inspection device so as to mold a first molded object during a first molding period, inspect the first molded object placed on the first placement unit during a first inspection period, convey the first molded object after inspection from the first placement unit to the third placement unit during a first conveyance period, mold a second molded object during a second molding period, inspect the second molded object placed on the second placement unit during a second inspection period, convey the second molded object after inspection from the second placement unit to the third placement unit during a second conveyance period, and overlap the first inspection period and the second molding period and overlap the second inspection period and the first conveyance period.
Semiconductor die carrier structure
An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
Semiconductor die carrier structure
An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
INJECTION MOLDING SYSTEM AND METHOD FOR MANUFACTURING MOLDED OBJECT
An injection molding system includes: an injection molding machine configured to operate in accordance with a command generated using a first language, and inject a molten material into a mold to mold a molded object; a robot configured to operate in accordance with a command generated using a second language, and convey the molded object; and a control device configured to control the injection molding machine and the robot. When determining that an error occurs in at least one of the injection molding machine and the robot, the control device transmits, to the injection molding machine, a command generated using the first language and for causing the injection molding machine to execute a return operation, and transmits, to the robot, a command interpretable by the second language and for causing the robot to execute a return operation, so as to cause the injection molding machine and the robot to execute the return operations.
INJECTION MOLDING SYSTEM AND METHOD FOR MANUFACTURING MOLDED OBJECT
An injection molding system includes: an injection molding machine configured to operate in accordance with a command generated using a first language, and inject a molten material into a mold to mold a molded object; a robot configured to operate in accordance with a command generated using a second language, and convey the molded object; and a control device configured to control the injection molding machine and the robot. When determining that an error occurs in at least one of the injection molding machine and the robot, the control device transmits, to the injection molding machine, a command generated using the first language and for causing the injection molding machine to execute a return operation, and transmits, to the robot, a command interpretable by the second language and for causing the robot to execute a return operation, so as to cause the injection molding machine and the robot to execute the return operations.
PLASTICIZATION DEVICE, THREE-DIMENSIONAL SHAPING DEVICE, AND INJECTION MOLDING DEVICE
A plasticization device includes: a cylinder having a supply port through which a material is supplied; a spiral screw configured to rotate inside the cylinder; a nozzle configured to discharge the material plasticized inside the cylinder; a heating unit provided between the supply port in the cylinder and the nozzle; a screw drive unit including a motor configured to rotate the screw; and a case configured to accommodate at least a part of the screw drive unit and having a first refrigerant flow path.
PLASTICIZATION DEVICE, THREE-DIMENSIONAL SHAPING DEVICE, AND INJECTION MOLDING DEVICE
A plasticization device includes: a cylinder having a supply port through which a material is supplied; a spiral screw configured to rotate inside the cylinder; a nozzle configured to discharge the material plasticized inside the cylinder; a heating unit provided between the supply port in the cylinder and the nozzle; a screw drive unit including a motor configured to rotate the screw; and a case configured to accommodate at least a part of the screw drive unit and having a first refrigerant flow path.
SEMICONDUCTOR DIE CARRIER STRUCTURE
An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
SEMICONDUCTOR DIE CARRIER STRUCTURE
An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
NOZZLE SHUT OFF FOR INJECTION MOLDING SYSTEM
An injection molding apparatus and method of fabricating a molded part are provided. The apparatus may include a barrel, a nozzle enclosing an end of the barrel and defining an opening in fluid communication with an inside of the barrel, and an extrusion screw positioned at least partially inside the barrel and rotatable relative to the barrel. The extrusion screw may include a screw tip. Relative axial movement between the barrel and the extrusion screw may open or close the opening of the nozzle to permit or prevent, respectively, material flow through the opening of the nozzle. The method may include clamping a mold, opening a nozzle, rotating the extrusion screw to pump a molten material into the mold until the mold is filled, closing the nozzle, and unclamping the mold to release a molded part.