An anti-warping design method for designing a resin molded article on a programmed computer includes dividing the molded article into a plurality of small elements, calculating sensitivity values for at least part of the elements with respect to warpage of the molded article, and displaying a distribution of the sensitivity values.

A higher-level substrate and lower-level substrates communicatively connected to the higher-level substrate are provided. The higher-level substrate is configured to obtain identification information from each of the lower-level substrates at first timing, to obtain identification information from each of the lower-level substrates at second timing following the first timing, and when the identification information obtained at the first timing is different from the identification information obtained at the second timing, notify a user of substrate replacement of that lower-level substrate for each lower-level substrate.

A shrinkage detection device for a polymer injection molding apparatus detects a shrinkage experienced by an injection molded element for assessing a quality of the molded element. Shrinkage, along with temperature and pressure of the melt within the mold during cooling, indicates a sufficiency of the resulting molded element for intended purposes. Sufficiency includes parameters such as flexibility, shear strength and longevity, and is accurately performed can replace conventional sample testing of molded articles that are expensive and time consuming.

An insert molding includes a lithium-ion battery, temperature measurement element and a pressure measurement element disposed close to the lithium-ion battery to sense temperature and pressure around the lithium-ion battery during insert molding; and a molding resin that covers the lithium-ion battery, the temperature measurement element, the pressure measurement element and a cover member.

A system includes a cavity, an injection nozzle configured to inject material into the cavity, and a plurality of sensors at sensor locations. Each of the plurality of sensors is configured to measure parameters at one of the sensor locations. The system lacks a strain gauge. The system further includes a controller configured to control a flow rate of the injection of material into the cavity. The controller is configured to receive the measured parameters and compare the received information to predetermined curves. The controller is configured to control the flow rate when the measured parameters deviate from the predetermined curves.

A manufacturing method of a semiconductor device includes the steps of: preparing a lead frame; mounting a plurality of semiconductor chips on the lead frame; and sealing one portion of the lead frame with a sealing resin. The resin-sealing step includes the step of: disposing the lead frame, molds having main surfaces on which cavity parts are formed, the lead frame being disposed on the main surface of the heated molds; injecting a resin in the main surfaces of the heated molds so as to seal the one portion of the lead frame with the sealing resin; and taking out the lead frame from the heated molds. In the taking-out step, while the lead frame is taken out, the main surfaces of the molds are inspected by using a sensor, and the sensor is cooled and formed integrally with an arm used for taking out the lead frame.

A method and apparatus for producing hollow articles made of injection moulded plastic material by a mould having a die within which there is inserted a core, and at least one injector including a pin valve displaceable between a closing position and an opening position for injecting the pressurized plastic material into a space comprised between the die and the core. During the injection, any flexural deflection of the core is detected and the pin valve of the or of each injector is displaced in a controlled fashion to adjust a pressure and a flow rate of the injected plastic material, so as to reduce or eliminate such deflection of the core.

A molding monitoring apparatus acquires an image of a molding molded by an injection molding machine, determines whether abnormality is present in the molding, and specifies an abnormality occurrence position thereof when the abnormality is present. Further, the molding monitoring apparatus calculates the number of abnormality occurrences for each abnormality occurrence position, and compares, among the calculated number of abnormality occurrences for each abnormality occurrence position, the number of abnormality occurrences for each abnormality occurrence position in a certain term with the number of abnormality occurrences for each abnormality occurrence position in another term.

A vibration sensor detects first data of a first component group and second data of a second component group. An injection molding machine performs diagnosis processing for diagnosing the first component group based on the first data in an injection mode and performs diagnosis processing for diagnosing the second component group based on the second data in a plasticization mode.

A molding management system includes a storage section configured to store molded article information including information on a number of defective articles for each item of molded article molded in a first period and information on a number of defective articles for each item of molded article molded in a second period, which is longer than the first period, a calculation section configured to generate a report based on the molded article information, and an output section that outputs the report generated by the calculation section. The report includes identification information, which is information for identifying an item of a molded article, information related to an actual defect rate for each item of molded article molded in the first period, information related to a defect rate target for each item of molded article in the first period, and information related to an actual defect rate for each item of molded article molded in the second period.