Patent classifications
B29C45/77
Fast acting reduced velocity pin control
Apparatus and method for performing an injection molding cycle using the apparatus where the apparatus comprises: a manifold, a pneumatic actuator driven by a pneumatic valve assembly, the actuator driving a valve pin between a gate closed position and a maximum injection fluid flow position, the pneumatic valve assembly having a spool supported within a cylinder driven by a drive device that is supported solely by and translates together with the spool, a controller that instructs the pneumatic valve assembly to cause the actuator to drive the valve pin either upstream or downstream to selected positions or at selected velocities during the course of a single injection cycle based on a feedback signal indicative of position of the pin or actuator or pressure of an injection fluid material.
SYSTEMS AND METHODS FOR CONTROLLING INJECTION MOLDING USING PREDICTED CAVITY PRESSURE
In order to improve the consistency of molded products as viscosity shifts throughout a run, a controller of an injection molding machine executes a calibration cycle in accordance with a mold cycle. The controller analyzes a plurality of sensed melt pressure values during the calibration cycle to determine one or more calibration metrics. The controller then uses the calibration metrics when executing each mold cycle of the run. More particularly, during each mold cycle of the run, the controller detects a plurality of sensed melt pressures prior to and during a fill phase of the mold cycle and compares the plurality of sensed melt pressures to the one or more calibration metrics to predict cavity pressure for a pack and hold phase of the mold cycle. The controller then adjusts a set point pressure for the pack and hold phase based on the predicted cavity pressure.
SYSTEMS AND METHODS FOR CONTROLLING INJECTION MOLDING USING PREDICTED CAVITY PRESSURE
In order to improve the consistency of molded products as viscosity shifts throughout a run, a controller of an injection molding machine executes a calibration cycle in accordance with a mold cycle. The controller analyzes a plurality of sensed melt pressure values during the calibration cycle to determine one or more calibration metrics. The controller then uses the calibration metrics when executing each mold cycle of the run. More particularly, during each mold cycle of the run, the controller detects a plurality of sensed melt pressures prior to and during a fill phase of the mold cycle and compares the plurality of sensed melt pressures to the one or more calibration metrics to predict cavity pressure for a pack and hold phase of the mold cycle. The controller then adjusts a set point pressure for the pack and hold phase based on the predicted cavity pressure.
DEVICE FOR MOLDING SEMICONDUCTOR PACKAGE
A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.
DEVICE FOR MOLDING SEMICONDUCTOR PACKAGE
A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.
Method and apparatus for substantially constant pressure injection molding of thinwall parts
A substantially constant pressure injection molding method and machine that forms molded parts by injecting molten thermoplastic material into a mold cavity at a substantially constant pressure. As a result, the mold cavity is filled with molten thermoplastic material by advancing a continuous flow front of thermoplastic material from a gate to an end of the mold cavity.
Method and apparatus for substantially constant pressure injection molding of thinwall parts
A substantially constant pressure injection molding method and machine that forms molded parts by injecting molten thermoplastic material into a mold cavity at a substantially constant pressure. As a result, the mold cavity is filled with molten thermoplastic material by advancing a continuous flow front of thermoplastic material from a gate to an end of the mold cavity.
Process and apparatus for injection molding of plastic materials
A method for injection molding of plastic material by means of at least one injector whose pin valve can be displaced between a fully closed position and a maximum open position in a controlled fashion according to a position and speed of the pin valve. During displacement of the pin valve from the fully closed position to the maximum open position, and/or vice versa, the pin valve is stopped in intermediate positions and the displacement speed thereof is uniform and constant. An initial opening step at maximum speed and one or more steps of inversion of the motion of the pin valve can be provided for.
Process and apparatus for injection molding of plastic materials
A method for injection molding of plastic material by means of at least one injector whose pin valve can be displaced between a fully closed position and a maximum open position in a controlled fashion according to a position and speed of the pin valve. During displacement of the pin valve from the fully closed position to the maximum open position, and/or vice versa, the pin valve is stopped in intermediate positions and the displacement speed thereof is uniform and constant. An initial opening step at maximum speed and one or more steps of inversion of the motion of the pin valve can be provided for.
MOLD AND TRANSFER MOLDING APPARATUS
According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.