B29C45/78

Method and device for visualizing or evaluating a process state
11241811 · 2022-02-08 · ·

A method for evaluating and/or visualizing a process state of a production system, which contains at least one cyclically operating shaping machine, includes: continuously or at discrete times, determining the value of a plurality of selected process variables, and comparing the current value of each selected process variable and or a variable derived therefrom with one or more reference values by means a computing unit, and determining a deviation or a rate of change. Each selected process variable is assigned to at least one logical group by the computing unit; at least two different logical groups are provided; and for each logical group, a state of the logical group is evaluated by the computing unit based on the process variables assigned to the logical group and/or is visualized by a display device.

Method and device for visualizing or evaluating a process state
11241811 · 2022-02-08 · ·

A method for evaluating and/or visualizing a process state of a production system, which contains at least one cyclically operating shaping machine, includes: continuously or at discrete times, determining the value of a plurality of selected process variables, and comparing the current value of each selected process variable and or a variable derived therefrom with one or more reference values by means a computing unit, and determining a deviation or a rate of change. Each selected process variable is assigned to at least one logical group by the computing unit; at least two different logical groups are provided; and for each logical group, a state of the logical group is evaluated by the computing unit based on the process variables assigned to the logical group and/or is visualized by a display device.

Injection molding system
11241812 · 2022-02-08 · ·

Provided is an injection molding system that uses an identification code, collectively manages the specifications and combinations of an injection molding machine and peripheral devices, and secures a suitable production state for a combination of a wide variety of specifications. An injection molding system include: an injection molding machine; a plurality of peripheral devices; an identification code attached to the injection molding machine and each of the plurality of peripheral devices, and having identification information of the injection molding machine and each of the plurality of peripheral devices; a code reader that reads the identification code; and a management unit including a storage unit that stores a correct combination of the identification code of the injection molding machine and the plurality of peripheral devices, and a confirmation determination unit for confirming whether the correct combination stored in the storage unit matches the identification code read by the code reader.

Injection molding system
11241812 · 2022-02-08 · ·

Provided is an injection molding system that uses an identification code, collectively manages the specifications and combinations of an injection molding machine and peripheral devices, and secures a suitable production state for a combination of a wide variety of specifications. An injection molding system include: an injection molding machine; a plurality of peripheral devices; an identification code attached to the injection molding machine and each of the plurality of peripheral devices, and having identification information of the injection molding machine and each of the plurality of peripheral devices; a code reader that reads the identification code; and a management unit including a storage unit that stores a correct combination of the identification code of the injection molding machine and the plurality of peripheral devices, and a confirmation determination unit for confirming whether the correct combination stored in the storage unit matches the identification code read by the code reader.

PROCESS FOR MOLDING A THERMOSETTING RESIN

A method of molding a thermosetting resin, in particular of the epoxy resin type, in which a first mold is filled with the resin while causing the temperature of the resin to vary in application of a first temperature program, without exceeding the Tg of the resin. After the first mold has been filled, the resin is put under pressure while causing the temperature of the resin to vary in application of a second temperature program, without exceeding Tg, and a drop in the pressure exerted by the resin on the mold is detected with the instant at which this pressure presents a break of slope being identified as the instant t1. A second mold is filled with the thermosetting resin in application of the first temperature program. After the second mold has been filled, the resin is put under pressure in application of the second temperature program until an instant t2 close to t1. As from t2, the temperature of the resin is increased to exceed Tg.

PROCESS FOR MOLDING A THERMOSETTING RESIN

A method of molding a thermosetting resin, in particular of the epoxy resin type, in which a first mold is filled with the resin while causing the temperature of the resin to vary in application of a first temperature program, without exceeding the Tg of the resin. After the first mold has been filled, the resin is put under pressure while causing the temperature of the resin to vary in application of a second temperature program, without exceeding Tg, and a drop in the pressure exerted by the resin on the mold is detected with the instant at which this pressure presents a break of slope being identified as the instant t1. A second mold is filled with the thermosetting resin in application of the first temperature program. After the second mold has been filled, the resin is put under pressure in application of the second temperature program until an instant t2 close to t1. As from t2, the temperature of the resin is increased to exceed Tg.

MOULD, MACHINE AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL ITEMS AND MANUFACTURING PLANT ASSOCIATED WITH SAME
20220032567 · 2022-02-03 ·

The invention relates to a mould (1) for manufacturing three-dimensional items, comprising a body (2); a lid (4) configured to close said body (2); and incorporated closing and opening means (5) configured to keep the body (2) and the lid (4) joined during the movement thereof. A machine (M1) for manufacturing three-dimensional items, comprising a receiving module (M2) configured to receive the mould (1); a conditioning module (M3) configured to receive the mould (1) from the receiving module (M2) and act on the incorporated closing and opening means (5) in order to separate the lid (4) from the body (2); and a handling module (M4) configured to receive the body (2) from the conditioning module (M3) and enable the placement of the components of the item to be manufactured. A method for manufacturing three-dimensional items and manufacturing plant associated with said machine (M1).

INJECTION MOLDING DIE
20220305705 · 2022-09-29 ·

Provided is an injection molding die capable of adjusting a size of a support member, preventing bending of a mold, and preventing occurrence of burrs without removing the mold and making the support member again. The present invention provides an injection molding die including a fixed mold and a movable mold that face each other, the fixed mold and the movable mold being clamped to form a cavity for molding a molded product, the injection molding die further including at least one support member that is provided to abut on a surface opposite to a surface on which the cavity is formed in either or both of the fixed mold and the movable mold, the at least one support member being a stretchable support member in a direction of the cavity.

Injection Overmolding with Heat/Cool Cycling for Making Optical Lenses Using 3D-Printed Functional Wafers
20220266488 · 2022-08-25 ·

Disclosed herein is an injection molding method for making optical thermoplastic lenses using 3D—printed functional wafers. The method employs a variable injection molding cavity temperature that is heated to at least wafer Tg—10° C.

DEVICE FOR MOLDING SEMICONDUCTOR PACKAGE
20170217062 · 2017-08-03 · ·

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.