A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A method of temperature control of a shaping tool or components of a shaping working machine is performed by a temperature control medium disposed in at least one temperature control branch of a temperature control system. A previously ascertained relationship between geometrical data of the at least one temperature control branch and through-flow amounts of the temperature control medium is provided, and a reference through-flow amount is set by the previously ascertained relationship for the geometrical data of the at least one temperature control branch.

A method of temperature control of a shaping tool or components of a shaping working machine is performed by a temperature control medium disposed in at least one temperature control branch of a temperature control system. A previously ascertained relationship between geometrical data of the at least one temperature control branch and through-flow amounts of the temperature control medium is provided, and a reference through-flow amount is set by the previously ascertained relationship for the geometrical data of the at least one temperature control branch.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

A process for resin transfer molding (RTM) with staggered injection of a resin is provided that injects resin into a plurality of injection ports of a mold. The temperature and pressure applied to the mold are controlled during injection to limit promote rapid filling of the mold cavity. The injection ports are activated for injecting the resin in any order of individually, in groups, or pairings. Fibers are readily added to the mold separately or within the resin. Cycle times of from 1 to 5 minutes are provided for the process.

A hot runner injection molding apparatus includes a hot runner nozzle and a first heater coupled to the nozzle body of the nozzle. A separate mold gate insert surrounds a nozzle tip area of the nozzle. The mold gate insert is heated by a second heater that is separate and independent from the nozzle body heater. The temperature generated by the first and second heaters is measured by a first thermocouple and a second thermocouple, respectively. A controller is used to adjust at any time the temperature of the first and second heaters independently. The second heater is used to either i) melt, and thus enable a faster removal of, a colder molten material accumulated around the nozzle tip during a color change procedure or ii) to reduce or increase the temperature of the nozzle tip differently from one nozzle to the next.

A hot runner injection molding apparatus includes a hot runner nozzle and a first heater coupled to the nozzle body of the nozzle. A separate mold gate insert surrounds a nozzle tip area of the nozzle. The mold gate insert is heated by a second heater that is separate and independent from the nozzle body heater. The temperature generated by the first and second heaters is measured by a first thermocouple and a second thermocouple, respectively. A controller is used to adjust at any time the temperature of the first and second heaters independently. The second heater is used to either i) melt, and thus enable a faster removal of, a colder molten material accumulated around the nozzle tip during a color change procedure or ii) to reduce or increase the temperature of the nozzle tip differently from one nozzle to the next.

The present disclosure provides a process for preparing a cured transparent rubber composition containing a synthetic isoprene polymer(s), a transparent polymer(s), a curing agent and additives. The process includes mixing the components at a temperature ranging from 50 to 130° C., curing the compound with peroxide and allowing the compound to mature. The maturated compound is fed to an injection molding machine. The cured transparent rubber composition prepared using the methods described herein has a haze of less than 30% and a total light transmission of more than 80%. The disclosure further provides an article including the cured transparent rubber composition, in particular for medical applications and artificial nipples.

The present disclosure provides a process for preparing a cured transparent rubber composition containing a synthetic isoprene polymer(s), a transparent polymer(s), a curing agent and additives. The process includes mixing the components at a temperature ranging from 50 to 130° C., curing the compound with peroxide and allowing the compound to mature. The maturated compound is fed to an injection molding machine. The cured transparent rubber composition prepared using the methods described herein has a haze of less than 30% and a total light transmission of more than 80%. The disclosure further provides an article including the cured transparent rubber composition, in particular for medical applications and artificial nipples.