The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

A three-dimensional computer model of a cooling mold for a part and a specification of an initial layout of one or more cooling channels integrated into the cooling mold is obtained. Data regarding temperatures of a cavity surface of the cooling mold in contact with the part is produced. Individual portions of the one or more cooling channels are moved toward hotter portions of the cavity surface, without moving any branch junctions of the one or more cooling channels and while keeping one or more diameters of the one or more cooling channels constant.

A three-dimensional computer model of a cooling mold for a part and a specification of an initial layout of one or more cooling channels integrated into the cooling mold is obtained. Data regarding temperatures of a cavity surface of the cooling mold in contact with the part is produced. Individual portions of the one or more cooling channels are moved toward hotter portions of the cavity surface, without moving any branch junctions of the one or more cooling channels and while keeping one or more diameters of the one or more cooling channels constant.

Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

A moving-body monitoring device has a position detection unit that outputs positional information of a moving body, a proximity sensor that detects the moving body, a first storage unit that stores a position when the moving body having moved in a first direction is detected as first positional information, and stores a position when the moving body having moved in a second direction is detected as second positional information, and a calculation unit that calculates a fixed-point position of a detecting region of the proximity sensor during monitoring as fixed-point positional information based on the first and second positional information. The device also has a second storage unit that stores reference fixed-point positional information, and a monitoring unit that, when a deviation between the fixed-point and reference fixed-point positional information goes beyond a stipulated range, determines that a positional deviation amount of the moving body exceeds a tolerance.

A moving-body monitoring device has a position detection unit that outputs positional information of a moving body, a proximity sensor that detects the moving body, a first storage unit that stores a position when the moving body having moved in a first direction is detected as first positional information, and stores a position when the moving body having moved in a second direction is detected as second positional information, and a calculation unit that calculates a fixed-point position of a detecting region of the proximity sensor during monitoring as fixed-point positional information based on the first and second positional information. The device also has a second storage unit that stores reference fixed-point positional information, and a monitoring unit that, when a deviation between the fixed-point and reference fixed-point positional information goes beyond a stipulated range, determines that a positional deviation amount of the moving body exceeds a tolerance.

An apparatus for molding process includes a mount including a base, a support on the base, first and second side columns, and a mounting member moveably on tops of the first and second columns; pneumatic first and second half molding assemblies for forming a mold; and first and second auxiliary devices cooperating with a die to insert the mold for molding. There are further provided second cooling devices, first and second lifting devices, first and second lowering devices, and a control device.

An apparatus for molding process includes a mount including a base, a support on the base, first and second side columns, and a mounting member moveably on tops of the first and second columns; pneumatic first and second half molding assemblies for forming a mold; and first and second auxiliary devices cooperating with a die to insert the mold for molding. There are further provided second cooling devices, first and second lifting devices, first and second lowering devices, and a control device.