Disclosed is a method of adjusting a motion profile of a shooting pot plunger for use in a molding system, the shooting pot plunger slidably movable within a shooting pot cavity, the method comprising: sensing a characteristic at a predetermined location in an injection circuit of the molding system; determining that the sensed characteristic is outside of a threshold range; adjusting the motion profile of the shooting pot plunger to account for determining that the sensed characteristic is outside of the threshold range; and storing the adjusted motion profile in a memory.

Disclosed is a method of adjusting a motion profile of a shooting pot plunger for use in a molding system, the shooting pot plunger slidably movable within a shooting pot cavity, the method comprising: sensing a characteristic at a predetermined location in an injection circuit of the molding system; determining that the sensed characteristic is outside of a threshold range; adjusting the motion profile of the shooting pot plunger to account for determining that the sensed characteristic is outside of the threshold range; and storing the adjusted motion profile in a memory.

Injection molding apparatuses and methods wherein a valve pin is controllably driven upstream and downstream along an axis between a first closed position where the tip end of the valve pin obstructs the gate to prevent the injection fluid from flowing into the cavity, a full open position and one or more intermediate positions, wherein the valve pin is drivable to be disposed or held in a selected intermediate position for a selected period of time during the course of an injection cycle where the tip end of the valve pin restricts flow of injection fluid through the gate to the mold cavity.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A process is provided for making a walled structure using an injection molding apparatus. The apparatus has a molding space formed between a mold cavity and an inner core disposed within the mold cavity. The molding space defines a shape of the structure. The process includes injecting molding material into the molding space, moving or retaining a portion of a movable impression member protruding from the inner core within a portion of the molding space so as to create a recess within an inner wall of the structure, and retracting the impression member into the inner core such that the impression member is cleared from the molding space. Precision control in forming the impression member is provided by a closed-loop configuration using a sensor that measures a molding space parameter (e.g., temperature), optionally in combination with a servo drive for activating the impression member.

A process is provided for making a walled structure using an injection molding apparatus. The apparatus has a molding space formed between a mold cavity and an inner core disposed within the mold cavity. The molding space defines a shape of the structure. The process includes injecting molding material into the molding space, moving or retaining a portion of a movable impression member protruding from the inner core within a portion of the molding space so as to create a recess within an inner wall of the structure, and retracting the impression member into the inner core such that the impression member is cleared from the molding space. Precision control in forming the impression member is provided by a closed-loop configuration using a sensor that measures a molding space parameter (e.g., temperature), optionally in combination with a servo drive for activating the impression member.

A mold component configured to be actuated between: a first configuration in which the mold component comprises a passage that allows passage of fluid (such as air) and prevents passage of the melt; and a second configuration in which the passage is actuated such as to become part of a molding surface.

A mold component configured to be actuated between: a first configuration in which the mold component comprises a passage that allows passage of fluid (such as air) and prevents passage of the melt; and a second configuration in which the passage is actuated such as to become part of a molding surface.

In an injection molding machine in which intermediate molds are disposed movably in a mold opening/closing direction between a movable platen attached with a movable mold and a stationary platen attached with a stationary mold, setting is simplified when individually setting a setting value related to molding using the movable mold and the intermediate mold and a setting value related to molding using the stationary mold and the intermediate mold. In a method for controlling an injection molding machine 11 in which intermediate molds 18 are disposed movably in a mold opening/closing direction between a movable platen 15 attached with a movable mold 14 and a stationary platen 17 attached with a stationary mold 16, single setting enables setting of both of a setting value related to molding using the movable mold 14 and the intermediate mold 18 and a setting value related to molding using the stationary mold 16 and the intermediate mold 18.