A technique for providing assistance in setting the time to increase the clamping force is provided. A control device of an injection molding machine includes a clamping control part and a monitoring part. The clamping control part is configured to change, in a filling step of filling the inside of a mold device with a molding material during clamping, a set value of clamping force from a first set value to a second set value that is larger than the first set value, at a predetermined pressurizing timing in the middle of the filling step. The monitoring part is configured to monitor changes in the actual value of the clamping force due to changes in the set value of the clamping force.

A specific mold status Ac is caused in advance in which the interval of an inner portion Xi in the parting plane direction of a parting gap C between a fixed mold 2c and a movable mold 2m during the injection filling is larger than the interval of an outer edge portion Xo and the interval of the outer edge portion Xo is equal to or lower than a predetermined size Ls including 0. A molding injection pressure Pi is set as an injection pressure at which a non-defective product can be molded and a molding mold clamping force Pc is set as a mold clamping force by which a non-defective product can be molded. During the production, a mold 2 is clamped by a molding mold clamping force Pc and the clamped mold 2 is filled with the injected resin R by a molding injection pressure Pi. After a predetermined cooling time Tc has passed, a molded piece G is removed.

A time Gt from the start of an injection step until a mold clamping operation is complete is compared with an operation time Ct for a mold clamping step. For Gt<Ct, the injection step is started when a time Dt equal to a difference between Gt and Ct elapses. On the other hand, for Gt≧Ct, after the start of the injection step, a movable platen is stopped at a mold touch position until the time Dt elapses. When the time Dt elapses, the mold clamping step is started.

A method and apparatus for injection molding of plastic material into a cavity of a mold by means of at least one injector whose opening and closing occurs through an electronic control unit and wherein an undesired opening of the mold caused by any overpressure of the plastic material injected into the cavity of the mold is detected by means of transducers and corrected by means of the electronic control unit. The transducers are arranged outside the cavity of the mold.

A method and apparatus for injection molding of plastic material into a cavity of a mold by means of at least one injector whose opening and closing occurs through an electronic control unit and wherein an undesired opening of the mold caused by any overpressure of the plastic material injected into the cavity of the mold is detected by means of transducers and corrected by means of the electronic control unit. The transducers are arranged outside the cavity of the mold.

Provided is an injection molding die capable of adjusting a size of a support member, preventing bending of a mold, and preventing occurrence of burrs without removing the mold and making the support member again. The present invention provides an injection molding die including a fixed mold and a movable mold that face each other, the fixed mold and the movable mold being clamped to form a cavity for molding a molded product, the injection molding die further including at least one support member that is provided to abut on a surface opposite to a surface on which the cavity is formed in either or both of the fixed mold and the movable mold, the at least one support member being a stretchable support member in a direction of the cavity.

An injection molding machine is provided that includes a clamping force sensor that detects a clamping force of a mold, and a clamping force monitoring unit that monitors a detected value of the clamping force sensor and calculates a first mold open distance and/or a second mold open distance. The first mold open distance is calculated based on the difference between the maximum value of the detected values obtained during an injection process and a pressure holding process and the detected value obtained at the start of the injection process. The second mold open distance that is calculated based on the difference between the detected value obtained at the end of the pressure holding process and the detected value obtained at the start of the injection process.

An injection molding machine is provided that includes a clamping force sensor that detects a clamping force of a mold, and a clamping force monitoring unit that monitors a detected value of the clamping force sensor and calculates a first mold open distance and/or a second mold open distance. The first mold open distance is calculated based on the difference between the maximum value of the detected values obtained during an injection process and a pressure holding process and the detected value obtained at the start of the injection process. The second mold open distance that is calculated based on the difference between the detected value obtained at the end of the pressure holding process and the detected value obtained at the start of the injection process.

Apparatus and method for performing an injection molding cycle using the apparatus where the apparatus comprises: a manifold, a pneumatic actuator driven by a pneumatic valve assembly, the actuator driving a valve pin between a gate closed position and a maximum injection fluid flow position, the pneumatic valve assembly having a spool supported within a cylinder driven by a drive device that is supported solely by and translates together with the spool, a controller that instructs the pneumatic valve assembly to cause the actuator to drive the valve pin either upstream or downstream to selected positions or at selected velocities during the course of a single injection cycle based on a feedback signal indicative of position of the pin or actuator or pressure of an injection fluid material.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.