An injection molding apparatus comprising: a pneumatically driven actuator having a piston mounted within a fluid sealed chamber for slidable axial movement along or against an interior surface of the fluid sealed chamber via a non-elastomeric engagement or with a non-elastomeric material disposed between the piston and the interior surface of the fluid sealed chamber, the piston forming first and second drive chambers within the fluid sealed chamber, each drive chamber having respective fluid flow ports, a source of pressurized gas that generates gas flow at a selected maximum pressure or flow rate, a gas metering mechanism, a controller interconnected to the gas metering mechanism, the controller controllably moving the gas metering mechanism to selectable positions that correspond to reduced pressures or reduced flow rates during the course of pin travel from the fully downstream gate closed position to the fully upstream gate open position.

The hydraulic source control device includes an operation input device capable of inputting operation conditions regarding the driving force of a fluid pressure control element, a servo motor including a motor section that drives a hydraulic pump and an amplifier that drives the motor section, and a controller that outputs a control command to the servo motor based on an input result to the operation input device. The controller obtains the fluid pressure of a working fluid based on the operation conditions regarding the input driving force, computes the output torque of the motor section based on the relationship between the fluid pressure and the output torque that are stored in advance, and outputs the computed output torque to the amplifier as a control command of the torque limitation value of the servo motor.

The hydraulic source control device includes an operation input device capable of inputting operation conditions regarding the driving force of a fluid pressure control element, a servo motor including a motor section that drives a hydraulic pump and an amplifier that drives the motor section, and a controller that outputs a control command to the servo motor based on an input result to the operation input device. The controller obtains the fluid pressure of a working fluid based on the operation conditions regarding the input driving force, computes the output torque of the motor section based on the relationship between the fluid pressure and the output torque that are stored in advance, and outputs the computed output torque to the amplifier as a control command of the torque limitation value of the servo motor.

A hydraulic drive device for a molding machine includes at least one motor, such as an electric motor, at least one first hydraulic pump which can be driven by the at least one motor, and at least one flywheel. At least one second hydraulic pump is connected, or can be connected, with the at least one flywheel, and a hydraulic connection conduct is provided between the first hydraulic pump and the second hydraulic pump.

A cell device includes a housing including an accommodation space and a door connected to the accommodation space, a movable device arranged in the accommodation space, and an operation section arranged in the accommodation space and configured to operate the movable device, wherein the door includes a light blocking section having a light blocking property and a light transmitting section having light transmissivity and in a state where the door is closed, the light blocking section overlaps with the operation section when the housing is viewed from a door side along a normal direction of the door. The operation section is arranged in the accommodation space so as to face the door and is arranged further to the door side than is the movable device.

A cell device includes a housing including an accommodation space and a door connected to the accommodation space, a movable device arranged in the accommodation space, and an operation section arranged in the accommodation space and configured to operate the movable device, wherein the door includes a light blocking section having a light blocking property and a light transmitting section having light transmissivity and in a state where the door is closed, the light blocking section overlaps with the operation section when the housing is viewed from a door side along a normal direction of the door. The operation section is arranged in the accommodation space so as to face the door and is arranged further to the door side than is the movable device.

An insert changeover system for an injection mold having a releasably secured insert for quick customizations of the injection mold. The insert changeover system includes a mold body having a pneumatic pull stock clamp and an insert having an insert guide pin. The pneumatic pull stock clamp is configured to releasably secure the insert guide pin when the insert is mounted on the mold body to selectively lock and unlock a position of the insert.

An insert changeover system for an injection mold having a releasably secured insert for quick customizations of the injection mold. The insert changeover system includes a mold body having a pneumatic pull stock clamp and an insert having an insert guide pin. The pneumatic pull stock clamp is configured to releasably secure the insert guide pin when the insert is mounted on the mold body to selectively lock and unlock a position of the insert.

A semiconductor die encapsulation or carrier-mounting method and apparatus for manufacturing a semiconductor product, wherein a first tool part for holding multiple semiconductor dies is provided and the semiconductor dies are placed on the first tool part, one of the first and a second tool part including displaceable insert members applying a pressure by each displaceable insert member on a surface area of the semiconductor die, and the first and second tool parts are brought together to define a space between the first and second tool parts with the semiconductor products being arranged within the space. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure, and subsequently, the first and second tool parts are separated and the processed semiconductor dies removed.

A semiconductor die encapsulation or carrier-mounting method and apparatus for manufacturing a semiconductor product, wherein a first tool part for holding multiple semiconductor dies is provided and the semiconductor dies are placed on the first tool part, one of the first and a second tool part including displaceable insert members applying a pressure by each displaceable insert member on a surface area of the semiconductor die, and the first and second tool parts are brought together to define a space between the first and second tool parts with the semiconductor products being arranged within the space. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure, and subsequently, the first and second tool parts are separated and the processed semiconductor dies removed.