A composite thermoplastic film and the manufacturing method are provided in the present invention. The method includes: providing a first structural layer and a second structural layer; performing a co-extrusion step to form a composite layer, in which to use a first extruding machine to perform the co-extrusion step, so the first structural layer is divided into a first thermal fuse film and a third thermal fuse film, and use a second extruding machine to perform the co-extrusion step, so the second structural layer is formed as a second thermal fuse film and disposed between the first thermal fuse film and the third thermal fuse film to form a composite layer; and performing a film-forming step, the composite layer is cooled to form a film through a forming wheel, and a rotating speed of the forming wheel can be controlled to acquire a desired thickness of the composite thermoplastic film.

A thermoplastic film composed of a single-layer of thermally fuse film. The single-layer of thermally fuse film has a melting point of 50° C.-160° C. and a Shore hardness ranges from 40 A-80 A. The present invention also provides another thermoplastic film, which has a multi-layer structure and the multi-layer structure from bottom to top, there are first thermally fuse film, second thermal fuse and third thermally fuse film. The thickness ratio of the first thermally fuse film, the second thermally fuse film and the third thermally fuse film is 1:1-2:1, in which the thermally fuse film, the first thermally fuse film, the second thermally fuse film, and the third thermally fuse film are thermoplastic polyurethane respectively, and thermoplastic polyurethane contains aromatic functional group or with aliphatic functional group.

A thermoplastic film composed of a single-layer of thermally fuse film. The single-layer of thermally fuse film has a melting point of 50° C.-160° C. and a Shore hardness ranges from 40 A-80 A. The present invention also provides another thermoplastic film, which has a multi-layer structure and the multi-layer structure from bottom to top, there are first thermally fuse film, second thermal fuse and third thermally fuse film. The thickness ratio of the first thermally fuse film, the second thermally fuse film and the third thermally fuse film is 1:1-2:1, in which the thermally fuse film, the first thermally fuse film, the second thermally fuse film, and the third thermally fuse film are thermoplastic polyurethane respectively, and thermoplastic polyurethane contains aromatic functional group or with aliphatic functional group.

The present invention relates to thermoplastic polyurethanes obtainable or obtained by reacting at least a polyisocyanate composition comprising at least one polyisocyanate, at least one chain extender, and at least one polyol composition, wherein the polyol composition comprises at least one polyester polyol (P1) which is obtainable by reacting an aliphatic dicarboxylic acid having 2 to 12 carbon atoms and a mixture (M1) comprising propane-1,3-diol and a further diol (D1) having 2 to 12 carbon atoms, preferably butane-1,4-diol. The present invention also relates to a preparation process for such thermoplastic polyurethanes and also to the use of a thermoplastic polyurethane according to the invention or of a thermoplastic polyurethane obtainable or obtained by a process according to the invention for the production of extrusion products, films and shaped bodies or for the production of polymer compositions.

The present invention relates to thermoplastic polyurethanes obtainable or obtained by reacting at least a polyisocyanate composition comprising at least one polyisocyanate, at least one chain extender, and at least one polyol composition, wherein the polyol composition comprises at least one polyester polyol (P1) which is obtainable by reacting an aliphatic dicarboxylic acid having 2 to 12 carbon atoms and a mixture (M1) comprising propane-1,3-diol and a further diol (D1) having 2 to 12 carbon atoms, preferably butane-1,4-diol. The present invention also relates to a preparation process for such thermoplastic polyurethanes and also to the use of a thermoplastic polyurethane according to the invention or of a thermoplastic polyurethane obtainable or obtained by a process according to the invention for the production of extrusion products, films and shaped bodies or for the production of polymer compositions.

An elastic resin material having a thermoplastic elastic resin as a main component is heated and melted, and the elastic resin material is discharged in a film or a linear shape from a discharge mechanism to form a film-shape or a linear-shape intermediate product. At a temperature above the temperature region at which the elastic resin material elastically deforms, extending is performed until the thickness or width of the film-shape intermediate product or the thickness of the linear-shape intermediate product assumes a prescribed value; with a cooling roller, the intermediate product is cooled to the temperature region at which the elastic resin material elastically deforms, and the intermediate product is hardened, forming a film-shape or linear-shape elastic member. The elastic member is stretched with a stretch roller to a prescribed stretching ratio, and the stretched elastic member is laminated on and bonded to a first base material sheet.

Acid-functionalized copolymers of methyl methacrylate having relatively high glass transition temperatures and molecular weights may be employed to manufacture articles having high light transmission values, low haze, high heat resistance, and high environmental stability, which are useful as optical protection films, zero-zero optical retardation films, and compensation films as well as lighting pipes and optical imaging lenses.

A method for producing a decorative floor covering comprises digitally printing an adhesive on a printing substrate thus generating an adhesive layer forming an at least one-dimensionally patterned decorative motif. The adhesive is a radiation-curable composition, preferably essentially free from non-reactive solvents and/or from photoinitiator. The printing substrate includes one of a core structure and a wear layer. After the printing of the adhesive, the adhesive layer on the printing substrate is contacted with the other one of the core structure and the wear layer. The core structure and the wear layer are then attached to each other by electron-beam curing the adhesive layer between them.

A method for producing a decorative floor covering comprises digitally printing an adhesive on a printing substrate thus generating an adhesive layer forming an at least one-dimensionally patterned decorative motif. The adhesive is a radiation-curable composition, preferably essentially free from non-reactive solvents and/or from photoinitiator. The printing substrate includes one of a core structure and a wear layer. After the printing of the adhesive, the adhesive layer on the printing substrate is contacted with the other one of the core structure and the wear layer. The core structure and the wear layer are then attached to each other by electron-beam curing the adhesive layer between them.

Provided is a method for manufacturing an LCP film for a circuit substrate capable of achieving an LCP film for a circuit substrate having a low coefficient of linear thermal expansion and excellent dimensional stability, without excessively impairing excellent basic performance possessed by the liquid crystal polyester, such as mechanical characteristics, electrical characteristics, and heat resistance. The method for manufacturing an LCP film for a circuit substrate at least comprising: a composition provision step of providing an LCP resin composition at least containing 100 parts by mass of a liquid crystal polyester and 1 to 20 parts by mass of a polyarylate; a film forming step of T-die melt-extruding the LCP resin composition to form a T-die melt-extruded LCP film having a coefficient of linear thermal expansion (α2) in a TD direction of 50 ppm/K or more; and a pressurizing and heating step of subjecting the T-die melt-extruded LCP film to pressure and heat treatment to obtain an LCP film for a circuit substrate having a coefficient of linear thermal expansion (α2) in the TD direction of 16.8±12 ppm/K.