The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

In one aspect, an article includes a first sleeve formed from a first heat-shrinkable polymer sheet, the first heat-shrinkable polymer sheet having opposed first and second edges, wherein the first sleeve is formed with a first seam proximate the first edge. A portion of the first heat-shrinkable polymer sheet extends between the first sleeve and the second edge. A tag is bonded to the portion of the first heat-shrinkable polymer sheet proximate the second edge at a first overlap zone of the tag and the portion of the first heat-shrinkable polymer sheet. In another aspect, an article includes a heat-shrinkable polymer sheet and a tag bonded to the sheet. The heat-shrinkable polymer sheet has a central area and a plurality of slits disposed through the sheet, at least one of the plurality of slits oriented to partially surround the central area.

In one aspect, an article includes a first sleeve formed from a first heat-shrinkable polymer sheet, the first heat-shrinkable polymer sheet having opposed first and second edges, wherein the first sleeve is formed with a first seam proximate the first edge. A portion of the first heat-shrinkable polymer sheet extends between the first sleeve and the second edge. A tag is bonded to the portion of the first heat-shrinkable polymer sheet proximate the second edge at a first overlap zone of the tag and the portion of the first heat-shrinkable polymer sheet. In another aspect, an article includes a heat-shrinkable polymer sheet and a tag bonded to the sheet. The heat-shrinkable polymer sheet has a central area and a plurality of slits disposed through the sheet, at least one of the plurality of slits oriented to partially surround the central area.

A method of installing a heat shrink cover around a component includes providing the heat shrink cover having an inner sleeve and an outer sleeve, the inner sleeve is a heat shrink sleeve, and attaching an electrical heating system to an outer surface of the outer sleeve. The inner sleeve and the outer sleeve are arranged around the component, with the outer sleeve at least partially encompassing the inner sleeve. The electrical heating system is energized to heat-recover the inner sleeve.

A heat-shrinkable plastic element that can notably improve insertability of a preform is provided. The heat-shrinkable plastic element is disposed on at least part of the outside of a preform, the preform including a mouth part, a body part linked to the mouth part, and a bottom part linked to the body part, the heat-shrinkable plastic element including: at least a layer containing (A) an ionomer resin and (B) an olefin resin as essential constituents, wherein the heat-shrinkable plastic element has a storage modulus at 25° C. of at least 4.0×10.sup.8 Pa, and the dynamic friction coefficient between the heat-shrinkable plastic element and the preform is at most 1.1.

A multilayered composite shape memory material includes a coextruded first polymer layer of a first polymer material and a second polymer layer of a second polymer material. The composite shape memory material after thermomechanical programming being capable of undergoing at least one temperature induced shape transition from a temporary shape to a permanent shape. The first polymer layer defines a hard segment of the shape memory material that provides the shape memory material with the permanent shape, and the second polymer layer defines a switching segment of the shape memory material that provides the shape memory material with the temporary shape.

A method of manufacturing a composite component comprises forming a core, surrounding the circumference of the core with a first layer of fabric, applying a second layer of fabric having a different coefficient of thermal expansion from the first layer such that the second layer extends around at least a portion of the circumference of the core and curing the component such that the second layer imparts a compressive or tensile force on the core.

An expansion apparatus includes: a first expander for irradiating with electromagnetic waves emitted from a lamp a thermal conversion layer for conversion of the electromagnetic waves to heat, to cause at least a portion of a thermal expansion layer to expand, the thermal conversion layer being laminated to a molding sheet including a base and the thermal expansion layer laminated to a first main surface of the base; and a second expander for causing expansion of a region (C) of the thermal expansion layer that is smaller in size than a region (B) of the thermal expansion layer expanded by the first expander.

In one aspect, an article includes a first sleeve formed from a first heat-shrinkable polymer sheet, the first heat-shrinkable polymer sheet having opposed first and second edges, wherein the first sleeve is formed with a first seam proximate the first edge. A portion of the first heat-shrinkable polymer sheet extends between the first sleeve and the second edge. A tag is bonded to the portion of the first heat-shrinkable polymer sheet proximate the second edge at a first overlap zone of the tag and the portion of the first heat-shrinkable polymer sheet. In another aspect, an article includes a heat-shrinkable polymer sheet and a tag bonded to the sheet. The heat-shrinkable polymer sheet has a central area and a plurality of slits disposed through the sheet, at least one of the plurality of slits oriented to partially surround the central area.

A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.