A laminating apparatus may include a first conveyor unit having a conveyance speed; a laminating unit disposed downstream of the first conveyor unit, wherein the laminating unit laminates a surface of a glass sheet with a film in a single stroke with the conveyance speed; and at least one first imaging unit disposed upstream of the laminating unit, the at least one first imaging unit correcting a position of the glass sheet entering the laminating unit.

A method for joining a lens with a housing of a lighting device for a motor vehicle, having the steps: positioning the housing in a receiving device of a welding device, said housing having on its underside at least one fastener for attaching the lighting device in the motor vehicle, identifying the position of the at least one fastener relative to the receiving device, calculating a correction value on the basis of the identified position of the at least one fastener, and moving the lens held in a holding device of the welding device in the direction of the housing along a travel distance and welding the lens to the housing.

A thermal bag comprising a thermal bag body and a thermal bag cover. The bag cover is connected to the bag body via a connecting member in an openable manner. The bag body comprises an inner bag (2), and outer bag (3) and a thermal layer (5) between the outer bag and the inner bag. A receiving cavity is provided inside the inner bag for receiving articles to be kept warm or cold. An inner bag platform is provided corresponding to an upper portion of the thermal layer between an upper side of the inner bag and an inner side of the outer bag. An abutting platform is provided corresponding to the inner bag platform on the bag cover which abuts against the inner bag platform when the bag cover is closed.

Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interface is determined by interposing a compressible, flexible sensor layer between the components before they are bonded. The sensor layer contains an array of piezoelectric elements which indicate local bondline thickness by signalling pressure due to compression of the layer. The bondline thickness profile can be processed by a programmed control processor to produce an adhesive application schedule prescribing the shapes of pieces of adhesive film which, when applied over the bonding interface, will build up an adhesive layer corresponding in thickness to the bondline thickness. The sensor layer can be prepared as a kit of shaped panels or as a contoured preform (55) matching the form of the bonding interface.

A clamping system for positioning a first component and a second component relatively to each other includes a clamping device, a separating foil and an electrical contacting device. The clamping device is adapted to fix the first and second components in a desired joining position under creation of a gap therebetween with a characteristic measure of tolerance relative to each other in a first position of the clamping device and to release this fixation in a second position of the clamping device. The separating foil includes an anti-stick layer and a heating layer connected with electrically conducting contact zones for heating a compensation compound arranged in the gap. The electrical contacting device is mechanically couplable with the clamping device or a supporting device holding the clamping device and is adapted for creating an electrical contact with the contact zones at least in the first position of the clamping device.

A thermal bag comprising a thermal bag body and a thermal bag cover. The bag cover is connected to the bag body via a connecting member in an openable manner. The bag body comprises an inner bag (2), and outer bag (3) and a thermal layer (5) between the outer bag and the inner bag. A receiving cavity is provided inside the inner bag for receiving articles to be kept warm or cold. An inner bag platform is provided corresponding to an upper portion of the thermal layer between an upper side of the inner bag and an inner side of the outer bag. An abutting platform is provided corresponding to the inner bag platform on the bag cover which abuts against the inner bag platform when the bag cover is closed.

A microfluidic circuit element comprising a microfluidic main channel and nano interstices is disclosed. The nano interstices are formed at both sides of the main channel and are in fluid communication with the main channel. The nano interstices have a height less than that of the main channel, gives more driving force of the microfluidic channel and provides stable flow of a fluid. The microfluidic circuit element may be made from a plastic material having a contact angle of 90 degrees or less. The microfluidic circuit element is particularly useful when filling a liquid sample to the channel which is empty or filled with air and shows greatly improved a storage stability.

A production method for a heat insulation bag with a more regular shape and less heat transfer, the method includes preparing a bag cover, an inner bag and an outer bag; placing a heat insulation layer between the inner bag and the outer bag; and then welding the heat insulation layer, the inner bag and the outer bag together. Improvements of the present invention include the steps of first preparing an inner bag periphery before preparing the inner bag, then welding an inner bag top sheet, welding an inner bag enclosure, cutting off the middle portion of the inner bag top sheet, and then welding a bottom surface of the inner bag, thereby forming an inner bag platform in the inner bag. Thus, heat transfer between the bag cover and the bag body after the production of the heat insulation bag is reduced and the heat insulation effect is improved.

The invention relates to a bonding tool for a bonding device for bonding at least one component by adhesives to a substrate, the bonding device including a circular disc-shaped main body lying in a main plane and having an opening and a receiving head connected to the main body for receiving and holding the components, an orthogonal projection of the receiving head onto the main plane lying within the opening so that the receiving head is freely accessible through the opening. The bonding tool has a lighting unit integrated in the bonding tool for curing the adhesive. The invention also relates to a bonding device for bonding at least one component by adhesives applied to a substrate located in an assembly position, and to a bonding method for bonding components by adhesives applied to a substrate.

A microfluidic circuit element comprising a microfluidic main channel and nano interstices is disclosed. The nano interstices are formed at both sides of the main channel and are in fluid communication with the main channel. The nano interstices have a height less than that of the main channel, gives more driving force of the microfluidic channel and provides stable flow of a fluid. The microfluidic circuit element may be made from a plastic material having a contact angle of 90 degrees or less. The microfluidic circuit element is particularly useful when filling a liquid sample to the channel which is empty or filled with air and shows greatly improved a storage stability.