Illustrative examples of forming and using suitably adapted materials for improving interface strength between thermoset-thermoplastic joined parts includes exposure of a thermoplastic substrate to a plasma to form an amine-functionalized substrate having amine chemical moieties disposed on a first surface. The first surface of the thermoplastic substrate is positioned adjacent to and contacts a second surface of a thermoset substrate to form a workpiece. The thermoset substrate includes epoxide chemical moieties on and within material forming the thermoset substrate. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first surface of the thermoplastic substrate and the second surface of the thermoset substrate. Thereafter, additional thermoplastic components can be fusion bonded to a surface of the thermoplastic substrate opposite the first surfacethereby providing improved attachment of additional thermoplastic components to the thermoset substrate.

Illustrative examples of forming and using suitably adapted materials for improving interface strength between thermoset-thermoplastic joined parts includes exposure of a thermoplastic substrate to a plasma to form an amine-functionalized substrate having amine chemical moieties disposed on a first surface. The first surface of the thermoplastic substrate is positioned adjacent to and contacts a second surface of a thermoset substrate to form a workpiece. The thermoset substrate includes epoxide chemical moieties on and within material forming the thermoset substrate. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first surface of the thermoplastic substrate and the second surface of the thermoset substrate. Thereafter, additional thermoplastic components can be fusion bonded to a surface of the thermoplastic substrate opposite the first surfacethereby providing improved attachment of additional thermoplastic components to the thermoset substrate.

A method for altering polymer properties for the molding of parts comprises exposing, to a scission-causing stressor, a region of a polymer form. The scission-causing stressor is controlled to achieve, in a relatively higher molecular-weight polymer at the region, an amount of scission that results in a reduction in the molecular weight of the relatively higher molecular-weight polymer, thereby forming a relatively lower molecular-weight polymer at the region.

The present disclosure relates more to processes for making a filter element that includes a filter membrane having a strip of thermoplastic polymer material laminated thereto, for example, as a strip along an edge of the filter membrane. For example, one such process includes providing a sheet of filter membrane having a first surface and an opposed second surface; providing a strip of thermoplastic polymer material having a first surface and an opposed second surface; contacting the first surface of the strip of thermoplastic polymer material with the first surface of the filter membrane; and softening the strip of thermoplastic polymer material at at least its first surface by irradiation with laser radiation; such that the softened polymer material of the first surface of the strip of thermoplastic polymer material bonds to the first surface of the filter membrane upon hardening.

A process and system are provided for introducing a blend of chopped and dispersed fibers on an automated production line amenable for inclusion in molding compositions as a blended fiber mat for structural applications. The blend of fibers are simultaneously supplied to an automated cutting machine illustratively including a rotary blade chopper disposed above a vortex supporting chamber. The blend of chopped fibers and binder form a chopped mat. The chopped mat has a veil mat placed on either side, and is consolidated with the veil mat using heated rollers maintained at the softening temperature of thermoplastic binder, with consolidated mats being amenable to being stored in rolls or as flat sheets. A charge pattern is made using the consolidated mat, and the charge pattern can be compression molded in a mold maintained at a temperature lower than the melting point of the thermoplastic fibers.

A profile includes: a sidewall, a lumen for a fluid path, and an end, the profile including a thermoset material, wherein the profile includes a sealed end without an external bonding material, wherein the sealed end withstands a seal integrity pressure test of at least 1 psi, such as at least 5 psi, such as at least 10 psi, such as at least 15 psi, or even at least 20 psi air pressure for about 30 minutes under dry and wet conditions.

Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.

A method of forming a reinforced panel may include engaging a reinforcement component having a faying surface with a first portion of a heated press, engaging an uncured panel component with an opposing second portion of the press, the panel component having a faying surface complementarily-configured with respect to the faying surface of the reinforcement component, treating the faying surface of the reinforcement component such that the faying surface is active for co-bonding with respect to the panel component, actuating the press to direct the first and second portions of the press toward each other, such that the faying surfaces are complementarily engaged under pressure; and heating the first and second portions of the press to a curing temperature associated with the panel component to substantially simultaneously co-bond the faying surfaces of the reinforcement component and the panel component together, cure the panel component, and form the reinforced panel.

A connection including a first profile having a first end and a first lumen, the first profile including a first polymeric material and a second profile having a second end and a second lumen, the second profile including a second polymeric material, a metal, or combination thereof, wherein the first end and the second end are coincidently welded via an ionized gas treatment.

A connection includes: a first profile having a first end, the first profile including a first polymeric material comprising a thermoset material; and a second profile having a second end, the second profile including a second polymeric material, a metal, or combination thereof, wherein the first end and the second end are coincidently bonded without a bonding material at an interface of the first end and the second end.