A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

A method for improving tear resistance of stretch films in which two stretch films are bonded together with an adhesive by hot rolling or UV curing such that their primary stretch directions cross each other. Composite films resulting from the invention possess significantly improved slit tear strength and tear resistance over biaxially stretched films with the same thicknesses. The invention can be widely used to improve tear resistance of stretch films fabricated from various existing materials and processes. In addition, it allows simple operations and is readily applicable to mass production.

A method of bonding a first part on a second part made of composite material by an adhesive, in which the adhesive is filled with elements of shape memory alloy, is provided. A method of un-sticking the first part adhesively bonded on the composite material second part is also provided. The un-sticking method includes a step of weakening the adhesive interface that consists in subjecting the adhesively bonded parts to heat treatment performed at a temperature that is lower or higher than the martensitic transformation temperature of the shape memory alloy elements.

A technique for stable, high-speed treatment of reinforcement fiber. In a state where a unidirectional fiber bundle is held between a supporting surface of a support and a pressing surface of a resonator ultrasonically vibrating in a pressing direction perpendicular to the supporting surface, a pressed part of the unidirectional fiber bundle pressed by the pressing surface is moved in a longitudinal direction of the unidirectional fiber bundle. By doing so, the unidirectional fiber bundle can be stably treated at high speed when the unidirectional fiber bundle is opened or impregnated with a resin.

Provided is a workpiece bonding method that makes it possible to achieve a joining state with a high strength and to obtain a good repeatability of the joining state.

A workpiece bonding method according to the present invention is a workpiece bonding method for bonding two workpieces to each other, each of the two workpieces being composed of a material selected from the group consisting of synthetic resin, glass, silicon wafer, crystal and sapphire, the workpiece bonding method including: a surface activation step of activating a bonded surface of at least one of the workpieces; and a laminating step of laminating the two workpieces such that respective bonded surfaces contact with each other, and a pretreatment step of removing moisture from the bonded surface of the workpiece that is to be subjected to the surface activation step is performed before the surface activation step is performed.

A sonic label welding device for welding multiple labels together using ultrasonic welding is disclosed. The sonic label welding device comprises a digital controls main menu screen which includes touch screen buttons that are utilized to go to specific screens to program the device to perform in a certain manner. For example, a user can press the cut to length button if wanting to cut a label to a specific length, or the label weld count button to specify the number of labels being sonically welded. Further, the sonic label welding device comprises a head for allowing multiple labels to be assembled under pressure and an anvil for directing the high frequency vibrations. A method of manufacturing a multi-layer care label is also disclosed.

An ultrasonic bonding apparatus includes a stage having an upper surface on a plane defined by a first direction and a second direction crossing the first direction, a head part spaced apart from the stage in a third direction crossing the first direction and the second direction, a first ultrasonic generator which vibrates in a direction parallel to the first direction, and a second ultrasonic generator which vibrates in a direction parallel to the third direction, where each of the first ultrasonic generator and the second ultrasonic generator may be coupled to the stage or the head part.

A method of joining first and second layers of material according to the principles of the present disclosure includes applying a layer of adhesive between the first and second layers and allowing the adhesive layer to at least partially cure. The method further includes piercing the first layer with a headless end of a rivet after the adhesive layer is cured, deforming the second layer with the headless end of the rivet, and bending the headless end of the rivet radially outward.

A process for forming defect-free fibrous composite materials. More particularly, a process for forming blister-free fibrous composites without having to actively monitor or control blister formation during molding of a stack of plies, and to blister-free composite materials fabricated therefrom. Fibrous plies are coated with a dry, particulate binder without impregnating the plies with the binder. Gaps between fibers/tapes allow air to diffuse out of the stack without affecting the binder coating, thereby avoiding blister formation.

A joining method for joining a resin member and a metal member by heating is provided. Joining of the resin member and metal member is performed by heating a joining interface of the resin member and metal member to a temperature in a range of equal to or higher than a decomposition temperature of the resin member and lower than a temperature at which gas bubbles are generated in the resin member and by cooling a surface of the resin member on the opposite side from a joining surface thereof with the metal member to a temperature that is lower than the melting point of the resin member.