Patent classifications
B29C66/949
Activating surfaces for subsequent bonding
A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND MANUFACTURING METHOD OF STRUCTURE
A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.
THERMAL CAULKING JOINED BODY
A caulking pin (15) is inserted into a mounting hole (21) provided in a metal case body (3), and the end portion of the caulking pin (15) is thermally caulked with a welding tip (24) to form a mold forming portion (17). A surplus absorption recess (31) is formed by enlarging the opening end of the mounting hole (21), and surplus resin is absorbed. The surplus absorption recess (31) is positioned inside a region of the mold forming portion (17). Therefore, the amount of molten surplus resin that protrudes outward from the welding tip (24) in the thermal caulking process is reduced.
Adhesive hook
An adhesive hook includes a base which has a bottom for fixing, an outer surface, and a hook provided at the outer surface. The bottom of the base is fixed on an external surface by means of an adhesive, and the adhesive is a curable adhesive. The structure of the adhesive hook is simple, and the curing speed of the curable adhesive is fast. After the curing process, the load bearing of the hook is larger than 1 Kg/cm2. Further, the adhesive hook has high cohesion strength after the adhesive is cured, and no remain is pasted on the external surface or the base after the hook is removed. The base can be recoated with new adhesive to reuse, which reduces cost and achieves recycling.
ULTRASONIC WELDING OF DISSIMILAR SHEET MATERIALS
A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.
Systems for the high-speed application of paper-based end closures on composite containers
A system for assembling a container and closure comprising an expanding collet which has a plurality of pivoting collet segments, each configured to simultaneously pivot radially outward about a pivot point and comprising. The collet comprises a lip that is engagable with the rim of the open end of the container and an angled tip positioned radially inward from the lip and shaped to press a countersink portion of the closure against an interior wall of the container as the collet segments pivot radially outward. As the container and the chuck are brought together, the rim engages with the lips of the collet segments and causes the angled tips of the collet segments to pivot outward toward the interior wall of the container, thereby pushing the countersink portion of the closure against the interior wall of the container.
Systems and methods for joining polymeric composites using conductive ink and a conductive rivet
A process, for joining workpieces using hybrid mechanical connector-resistance welding. The process in some embodiments includes introducing a conductive fluid to an interface between the workpieces. The process also includes inserting at least one mechanical conductive connector into at least one of the workpieces so that the connector reaches the interface having the conductive fluid therein. The process in some embodiments includes further applying energy for welding to the at least one mechanical conductive connector so that the energy passes, through the connector, to the conductive fluid and heat is generated in the workpieces at the interface, thereby melting the workpieces and forming a weld joint connecting the workpieces.
Secondary Battery Sealing Process and Secondary Battery Manufacturing Method Comprising the Same
The present invention provides a sealing process for a secondary battery of the present invention, which thermally fuses and seals a sealing portion that extends along an edge surface of a battery case, the sealing process comprising: an arrangement operation of disposing the sealing portion of the battery case between an anvil and a horn; a first region-fixing operation of pressing and fixing a first region of the sealing portion through the anvil and the horn; and a first region-primary sealing operation of applying an ultrasonic wave to the first region of the sealing portion through the horn at a set frequency and a set amplitude for a set time, thereby thermally fusing the first region of the sealing portion.
Magnetic Plastic Induction
A plastic product having magnetic properties and a method for making the same is provided. The method comprises creating a mixture of a nylon and a metal, melting the mixture to create a melted mixture of the metal suspended in the nylon, injecting the melted mixture into a mold to harden the melted mixture and shape the melted mixture into the product's shape, applying an electrical current to the mold while the mixture is in a viscous state to align the poles of the metal suspended in the nylon in the mixture in a single direction before the mixture has hardened, and applying a magnetic field to the hardened mixture to provide the product with magnetic properties.
Device, In Particular for Closing a Head Region of a Foodstuffs Container Made of a Laminate Having an Edge Region Which is Skived and Partially Folded Over Itself
The invention relates to a device comprising a first fixing element, a further fixing element and a folded planar composite; wherein the first fixing element comprises a first fixing surface and the further fixing element comprises a further fixing surface; wherein the folded planar composite is at least partially fixed between the first fixing surface and the further fixing surface; wherein the folded planar composite comprises a first composite region; wherein the first composite region comprises a first layer sequence comprising a first composite layer comprising a first carrier layer, a second composite layer comprising a second carrier layer, a third composite layer comprising a third carrier layer and a fourth composite layer comprising a fourth carrier layer; wherein in the first composite region the second composite layer is joined to the third composite layer and the third composite layer is joined to the fourth composite layer; wherein in the first composite region the third carrier layer is characterised by a smaller layer thickness than in each case one selected from the group consisting of the first carrier layer, the second carrier layer and the fourth carrier layer or a combination of at least two of these; wherein the first fixing surface or the further fixing surface or both comprises a recess comprising a first recess region; wherein the first composite region is located at least partially between the first recess region and the first fixing surface or the further fixing surface.