A method includes pressing a face of a stamp into a first portion of a replication material disposed on a substrate, to cause the replication material to have a predetermined characteristic, exposing the first portion of the replication material to illumination, to modify the first portion of the replication material, and subsequently removing a second portion of the replication material that was not exposed to the illumination. An optical device includes a substrate, a portion of replication material disposed on a first surface of the substrate, the portion of replication material forming one or more diffractive optical elements, and a masking layer disposed on a second surface of the substrate, the second surface being opposite the first surface, in which a sidewall of the replication material has a straight profile, and in which the masking layer defines an aperture aligned with the portion of the replication material.

A method of manufacturing a plurality of optical elements (140), the method comprising providing a first wafer (120) having hardened replication material forming optical elements (140) on a first side of the first wafer (120), providing a second wafer (121) having hardened replication material forming optical elements (140) on a first side of the second wafer (121), depositing liquid droplets (180) on the first side of the first wafer (120) between the optical elements (140) aligning the first side of the first wafer (120) with the first side of the second wafer (121), and bringing the two wafers (120, 121) together such that the liquid droplets (180) on the first side of the first wafer (120) adhere to the first side of the second wafer (121).

A lens includes a cover part and an interposing member formed of a light-reflecting material. The cover part includes a lens part having a lateral side, a connection part constituting a lateral side wall extending from the lateral side, and a flange part having a lower surface disposed below the lateral side wall. The interposing member has an upper surface and an inner lateral surface. The upper surface is disposed on the lower surface of the flange part. The lens part and the interposing member define a recess having an opening facing downward. The lens part defines a bottom surface of the recess. The inner lateral surface defines a lateral surface of the recess, which defines the opening of the recess. The flange part extends outward from the opening. The lens part has a convex lens and a light-emitting surface with projections outward from the convex lens.

A method of producing a lens molded article includes a state determination of determining, after molding the lens molded article, whether a state is a first state where the lens molded article molded remains in an upper mold or a second state where the lens molded article molded remains in a lower mold; an adsorption of adsorbing an exposed surface of the lens molded article remaining in the upper mold or the lower mold, by an adsorption device disposed at an arm of a molded article moving device; an adsorption surface change of changing an adsorption surface from a surface adsorbed by the adsorption device to an opposite surface to the exposed surface when the determination result in the state determination is either one of the first state or the second state; and a placement of placing on a tray the lens molded article adsorbed by the adsorption device.

A method of manufacturing an optical structure may include providing a base structure that includes a substrate having an optical element extending from a first side of the substrate and dispensing liquid photoresist onto the base structure. The method may further include forming a layer of said liquid photoresist where the height of said layer is controlled by lowering the tool to a height above said substrate, and forming a spacer from the liquid photoresist by exposing a portion of the liquid photoresist to ultraviolet light. The spacer may include a central aperture above the optical element.

Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

A cut pattern for a film or film laminate used in the fabrication of optical articles such as lenses.

An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

An optical element including a first substrate, a second substrate, a first optical film, a second optical film, and a spacer is provided. The first optical film is disposed on the first substrate and has a first surface and a plurality of first optical microstructures. The first optical microstructures are disposed on the first surface. The second optical film is disposed on the second substrate and has a second surface and a plurality of second optical microstructures. The second surface is opposite to the first surface. The second optical microstructures are disposed on the second surface. The orthogonal projection of the first optical microstructures on the first substrate does not overlap with the orthogonal projection of the second optical microstructures on the first substrate. The spacer is disposed between the first substrate and the second substrate. A wafer level optical module adopting the optical element is also provided.