A steel sheet comprising, in wt %, 0.04≦C≦0.30, 0.5≦Mn≦4, 0≦Cr≦4, 2.7≦Mn+Cr≦5, 0.003≦Nb≦0.1 0.015≦Al≦0.1 and 0.05≦Si≦1.0, has a chemistry that makes hot formed sheet after austenization insensitive to cooling rate and ensures a uniform distribution of tensile strength, in the range of 800-1400 MPa, across parts independent of the time delay between operations and final cooling/quenching. As a result, a formed part can be cooled while inside a die or in air. The addition of Nb reduces the amount of C needed to achieve a given tensile strength and improves weldability.

This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion (13) by bending the clad material.

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

This hot stamping member is a hot stamping member including a base material and a plating layer provided on the base material, in which the plating layer has a Ni-rich region, an Al-rich region and an Fe-rich region in this order from a surface of the plating layer, in a region from the surface of the plating layer to a 100 nm position in the thickness direction from the surface of the plating layer, Ni and Fe satisfy predetermined contents, in a region from the 100 nm position in the thickness direction from the surface of the plating layer to a 500 nm position in the thickness direction from the surface of the plating layer, Ni and Fe satisfy predetermined contents, and, in a region from the 500 nm position in the thickness direction from the surface of the plating layer to a 1000 nm position in the thickness direction from the surface of the plating layer, Ni and Fe satisfy predetermined contents.

A canted coil spring includes a core wire 10 formed of steel having a pearlite structure; and a copper plating layer 20 formed of copper or a copper alloy and covering an outer circumferential surface 11 of the core wire 10. The steel contains 0.5 mass % or more and 1.0 mass % or less carbon, 0.1 mass % or more and 2.5 mass % or less silicon, and 0.3 mass % or more and 0.9 mass % or less manganese, with the balance being iron and inevitable impurities. The copper plating layer 20 has a crystallite size of 220±50 Å.

This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a Δω of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.

A panel for attenuating noise is disclosed comprising a face skin having a first inner surface, a base skin having a second inner surface, a cellular core connected to and forming a plurality of cells between the face skin and the base skin, wherein the cellular core is defined by a cell structure having a plurality of cell walls extending between the face skin and the base skin defining each of the plurality of cells and a septum disposed within each of the plurality of cells, the septum defining an upper chamber proximate the face skin and a lower chamber proximate the base skin, wherein the face skin comprises a plurality of perforations fully through the face skin and in fluid communication with the upper chamber.

This foil for a secondary battery negative electrode collector (negative electrode-collecting foil 5b) includes a first Cu layer (51) made of Cu or a Cu-based alloy, a stainless steel layer (52), and a second Cu layer (53) made of Cu or a Cu-based alloy, which are disposed in this order, a total thickness is 200 μm or less, and 0.01% proof stress is 500 MPa or more.

A process of fabricating a shield, a process of preparing a component, and an erosion shield are disclosed. The process of fabricating the shield includes forming a near-net shape shield. The near-net shape shield includes a nickel-based layer and an erosion-resistant alloy layer. The nickel-based layer is configured to facilitate secure attachment of the near-net shaped to a component. The process of preparing the component includes securing a near-net shape shield to a substrate of a component.

An RFI/EMI shielding material composed of a conductive multi-fiber having a plurality of metalized monofilaments, each monofilament having a core of stainless steel or low carbon steel with an initial diameter and at least two layers of metal or metal alloy electroplated on the core which is drawn after electroplating to a final diameter less than the initial diameter, in the range of about 45-80 μm.