The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.

The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass % or more and 45.0 mass % or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40° C. or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 μm or more and 15.0 μm or less, and the thickness of the base layer is 1.0 μm or more and 18.0 μm or less.

A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass % or more and 45.0 mass % or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40° C. or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 μm or more and 15.0 μm or less, and the thickness of the base layer is 1.0 μm or more and 18.0 μm or less.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec-1 and measured at a temperature of 120° C., being 5.0×103 poise to 1.0×105 poise inclusive.

The invention relates to a method for manufacturing a foam-formed cellulosic fibre-material comprising coarse cellulosic fibres a cellulose reinforcement fraction. Furthermore, the invention relates to a foam-formed cellulosic fibre-material, a cellulose bulk sheet for a packaging material and a laminated packaging material comprising the foam-formed cellulosic fibre-material.

The invention relates to a method for manufacturing a foam-formed cellulosic fibre-material comprising coarse cellulosic fibres a cellulose reinforcement fraction. Furthermore, the invention relates to a foam-formed cellulosic fibre-material, a cellulose bulk sheet for a packaging material and a laminated packaging material comprising the foam-formed cellulosic fibre-material.

The multilayer film of the present disclosure has at least a heat-sealing layer and a support layer formed on one side of the heat-sealing layer, wherein the first resin composition forming the heat-sealing layer comprises (a) high-density polyethylene, (b) a propylene random copolymer, and (c) a 1-butene polymer, wherein the content of the component (a) is 30 to 60% by mass, the content of the component (b) is 8 to 42% by mass, and the content of the component (c) is 16 to 56% by mass, wherein the component (a) has a melt flow rate of 10 to 30 g/10 minutes at 190° C., the component (b) has a melt flow rate of 8 to 20 g/10 minutes at 230° C., and the component (c) has a melt flow rate of 0.3 to 3 g/10 minutes at 190° C.

The multilayer film of the present disclosure has at least a heat-sealing layer and a support layer formed on one side of the heat-sealing layer, wherein the first resin composition forming the heat-sealing layer comprises (a) high-density polyethylene, (b) a propylene random copolymer, and (c) a 1-butene polymer, wherein the content of the component (a) is 30 to 60% by mass, the content of the component (b) is 8 to 42% by mass, and the content of the component (c) is 16 to 56% by mass, wherein the component (a) has a melt flow rate of 10 to 30 g/10 minutes at 190° C., the component (b) has a melt flow rate of 8 to 20 g/10 minutes at 230° C., and the component (c) has a melt flow rate of 0.3 to 3 g/10 minutes at 190° C.