A resin composition exhibiting excellent adhesive strength when used as an adhesive and a cured product using the same are provided. Further, a laminate using the cured product and a method for producing the laminate are provided.

A resin composition including: 1,1-dicyanoethylene (A), a polymerizable monomer (B) represented by general formula (I) below, and a polymerizable monomer (C) represented by general formula (II) below:

CH.sub.2CR.sup.1R.sup.2(I)

CHR.sup.6CR.sup.7R.sup.8(II)

A laminate article includes a silicone pressure sensitive adhesive adhered to a silicone rubber article. A method for fabricating the laminate article is provided.

Described herein is a process for producing polyurethane sandwich moldings including at least one core layer and at least one reinforcing fiber layer, where (i) at least one reinforcing fiber layer is applied onto a core layer and a moisture-curing polyurethane adhesive is applied to a reinforcing fiber layer, (ii) the part from (i) is placed into a mold and pressed in the mold and the moisture-curing polyurethane adhesive is cured, and (iii) the molding from (ii) is removed from the mold and optionally subjected to further operations, where the moisture-curing polyurethane adhesive is applied before or after application of the reinforcing fiber layer onto the at least one core layer and for the curing the moisture-curing polyurethane adhesive is brought into contact with water or with a solution comprising water. Also described herein are a polyurethane sandwich molding obtainable by such a process and a method of using a polyurethane sandwich molding in vehicles.

An adhesive structure includes a first adherend, a first plasma polymer layer, an adhesive layer, a second plasma polymer layer, and a second adherend in this order. Each of the first plasma polymer layer and the second plasma polymer layer contains an organopolysiloxane as a main component. A thickness of each of the first plasma polymer layer and the second plasma polymer layer is in a range of 10 nm to 100 nm.