A gas barrier film comprising a substrate layer containing a filler, an anchor coat layer provided on the substrate layer, and a gas barrier layer provided on the anchor coat layer. In the gas barrier film, an average particle diameter D of the filler is 0.02 to 3.00 m, a thickness of the substrate layer is equal to or larger than the average particle diameter of the filler, and a total thickness T of one or more layers disposed between the substrate layer and the gas barrier layer is 0.02 to 0.40 m.

A sound-absorbing air duct for a vehicle includes a lower non-woven fabric and an upper non-woven fabric sandwiching wires therebetween; and a film made of a polyester resin having a low melting point and disposed on the upper non-woven fabric, wherein each of the lower and upper non-woven fabrics includes a mixture between a first polyester fiber containing a polyester resin having a melting point higher than 250 C. and a second polyester fiber containing a polyester resin having a low melting point and having a softening point of 100 C. to 150 C., wherein the second polyester fiber includes a polyester resin having a low melting point composed of: an acid component including terephthalic acid or an ester-forming derivative thereof; and a diol component including 2-methyl-1,3-propanediol, 2-methyl-1,3-pentanediol, and ethylene glycol.

Composite honeycomb that may be contoured to form composite honeycomb structures, which have tight radii of curvatures and/or compound curvatures, and which are suitable for use in high temperature environments. The method for making the composite honeycomb involves using high temperature prepreg to make a flexible composite honeycomb that is formed into a composite honeycomb precursor. A high temperature coating resin is applied to the composite honeycomb precursor to form the high temperature composite honeycomb.

A polyester film and a method for producing the same are provided. The polyester film includes a heat resistant layer. The heat resistant layer includes a high temperature resistant resin material and a polyester resin material. The high temperature resistant resin material and the polyester resin material are melted and kneaded with each other via a twin screw granulator. The twin-screw granulator has a twin-screw temperature between 250 C. and 320 C., and the twin-screw granulator has a twin-screw rotation speed between 300 rpm and 800 rpm, so that the high temperature resistant resin material is dispersed in the polyester resin material with a particle size of between 50 nm and 200 nm.

A fiber-reinforced resin composite material includes first and second members. The first member includes a first fiber and a first matrix resin. The first fiber includes a reinforcing fiber and is impregnated with the first matrix resin. The reinforcing fiber has a melting point and a tensile strength higher than those of an aliphatic polyamide fiber. The second member includes a stack and a second matrix resin. The stack includes a second fiber and a third fiber filled with the second matrix resin. The second fiber includes the reinforcing fiber. The second matrix resin includes a component common to that of the first matrix resin, and includes a first polyamide resin that includes an aliphatic polyamide resin. The third fiber includes a second polyamide resin that includes an aliphatic polyamide resin and has a melting point higher than that of the first polyamide resin by 7 to 50 degrees centigrade.

Disclosed are compositions and methods for multilayer films, which, in one embodiment may comprise a core layer comprising at least 50 wt. % of high-density polyethylene. Further, the multilayer film may include a first skin layer comprising at least 80 wt. % of high-density polyethylene, and a second skin layer comprising either: (i) one or more low-density polyethylenes; or (ii) one or more polypropylene-based copolymers. The multilayer film may be oriented in at least one direction.

The present invention relates to a method for producing a conductive composite material, as well as the composite material capable of being obtained by said method. The conductive material is obtained from a composite polymer matrix, which is formed by aggregation of composite conductive particles consisting of particles of a polymer matrix, having a diamter d50 of between 1 and 4000 m, coated with a layer of electrically conductive material consisting of at least one metal. The ratio of the thickness of the conductive layer to the diameter d50 of the polymer matrix particles is between 0.0025:100 and 1.5:100, said thickness being less than 300 nm.

An adhesive film for a printed wiring board includes an adhesive layer 111 and an insulating protective layer 112. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.

Composite honeycomb that may be contoured to form composite honeycomb structures, which have tight radii of curvatures and/or compound curvatures, and which are suitable for use in high temperature environments. The method for making the composite honeycomb involves using high temperature prepreg to make a flexible composite honeycomb that is formed into a composite honeycomb precursor. A high temperature coating resin is applied to the composite honeycomb precursor to form the high temperature composite honeycomb.

A decorative sheet including a substrate layer, and one or more layers of at least one of a transparent resin layer and a top coat layer provided on one surface of the substrate layer, the one or more layers being provided as a front surface layer, wherein at least one layer of the transparent resin layer and the top coat layer contains a radical scavenger, and the radical scavenger is contained in a form of radical scavenger vesicles, which encapsulate the radical scavenger within an outer membrane.