A high-frequency dielectric heating adhesive sheet includes: a first adhesive layer; a second adhesive layer; and an intermediate layer located between the first adhesive layer and the second adhesive layer, the first adhesive layer containing a first thermoplastic resin and a first dielectric filler configured to generate heat in response to a high-frequency wave, the second adhesive layer containing a second thermoplastic resin and a second dielectric filler configured to generate heat in response to the high-frequency wave, the intermediate layer containing no dielectric filler in response to the high-frequency wave.

A wallpaper includes a support portion having a flat surface, and a functional layer disposed on the flat surface of the support portion. The functional layer includes a metallic film and has an emissivity of greater than zero and equal to or less than 0.6. The wallpaper further includes a particulate layer disposed on the functional layer and including a polymer body and inorganic particles dispersed in the polymer body.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.

A high-adsorption-performance nanofiber filter medium includes a support material and a composite nanofiber filtration layer that includes multiple nanometer composite nanofiber layers deposited and stacked on the support material. The nanometer composite nanofiber layer includes first, second, and third nano-powder composite nanofibers, which are uniformly mixed by means of an airflow or are sequentially laminated to form the nanometer composite nanofiber layer. The nanometer composite nanofiber layer formed through sequential lamination includes first, second, and third nanofiber layers. The first nanofiber layer includes multiple first nano-powder composite nanofibers. The second nanofiber layer is stacked on the first nanofiber layer and includes multiple second nano-powder composite nanofibers. The third nanofiber layer is stacked on the second nanofiber layer and includes multiple third nano-powder composite nanofibers. The composite nanofiber filtration layer is formed of multiple nanometer composite nanofiber layers, so that the high-adsorption-performance nanofiber air filter medium shows improved performance.

A plastic wrap and a method for manufacturing the same are provided. The plastic wrap includes at least one resin layer that includes a resin composition. The resin composition includes, based on 100 wt % of the resin composition, 1 to 14 wt % of an inorganic nano powder. The inorganic nano powder includes 1 to 30 wt % of zinc oxide, 1 to 20 wt % of titanium oxide, and at least one of 1 to 35 wt % of a silver salt-doped silicon oxide and 1 to 15 wt % of a rare earth metal salt.

Implementations for composite display cover are described and provide improved protection and durability to device displays as compared with conventional display protection technologies. The described composite display cover, for instance, utilizes an ultra-thin glass layer with a polymer film applied directly to the glass layer and a hard coat applied to the polymer film. The polymer film, for instance, is applied to the glass layer without an adhesive. Further, the composite display cover can be attached to a display, such as via an adhesive layer that adheres the glass layer to a surface of the display.

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

A plastic wrap and a method for manufacturing the same are provided. The plastic wrap includes at least one resin layer that includes a resin composition. The resin composition includes, based on 100 wt % of the resin composition, 1 to 14 wt % of an inorganic nano powder. The inorganic nano powder includes 1 to 30 wt % of zinc oxide, 1 to 20 wt % of titanium oxide, and at least one of 1 to 35 wt % of a silver salt-doped silicon oxide and 1 to 15 wt % of a rare earth metal salt.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

The present disclosure discloses a multilayer film comprising: (a) at least one print layer (102); (b) at least one tie layer (104); (c) at least one second tie layer (108); and (d) at least one sealant layer (110), wherein the multilayer film comprises at least one polyethylene having a weight percentage in the range of 80-95% with respect to the multilayer film, and a density in the range of 0.941-0.99 gm/cm.sup.3. Also disclosed herein is a process of manufacturing a multilayer film.