According to various examples of the present disclosure, an antimicrobial assembly includes a substrate comprising a matrix material having opposed first and second surfaces with a total thickness of the substrate defined therebetween. The assembly further includes an antimicrobial composition bound to the substrate and heterogeneously distributed about the antimicrobial assembly.

A method of manufacturing a structural arrangement on the basis of a fiber reinforced polymer component, comprising at least the steps of: providing a fiber reinforced polymer component; fixing a polyether sulfone foil on the fiber reinforced polymer component, at least in a region where an electrically conductive layer is to be formed; and performing a cold gas spraying process for spraying electrically conductive particles onto the polyether sulfone foil in order to create the electrically conductive layer.

The base material for printed circuit board according to one aspect of the present disclosure is a base material for printed circuit board comprising a base film having an insulating property, a sintering layer inducing a plurality of copper particles and formed on at least one surface of the base film and an electroless copper plating layer formed on a surface of the sintering layer, the surface being on an opposite side to the base film, and filled in the sintering layer, and wherein a lightness L* of a surface of the electroless copper plating layer, the surface being on an opposite side to the sintering layer, is 45.0 or more and 85.0 or less, a chromaticity a* thereof is 5.0 or more and 25.0 or less, and a chromaticity b* thereof is 5.0 or more and 25.0 or less.

A capacitive stealth composite structure includes a plurality of structural layers stacked in a thickness direction, and the number of layers of the structural layers is three or more, wherein each of the structural layers consists of a plurality of electromagnetic wave absorbing patterns and a plurality of insulation patterns alternately arranged in a horizontal direction. The electromagnetic wave absorbing patterns in each of the structural layers are aligned with the insulation patterns of an adjacent structural layer, and the insulation patterns in each of the structural layers are aligned with the electromagnetic wave absorbing patterns of an adjacent structural layer.

A structural arrangement comprising a fiber reinforced polymer component, a cold gas spraying electrically conductive layer, and a polyether sulfone foil arranged on the fiber reinforced polymer component, at least in a region between the fiber reinforced polymer component and the cold gas sprayed electrically conductive layer.

A heat-conducting sheet 1 comprising a first heat-conducting layer 1a and a second heat-conducting layer 1b, which each comprise a polymer matrix 2 and an anisotropic filler 3, and wherein the anisotropic filler is oriented in a thickness direction. The first and second heat-conducting layers 1a and 1b are laminated via an interface 5 in which a filling ratio of the anisotropic filler 3 is lower than that of the first and second heat-conducting layers 1a and 1b.

Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180 C. to 270 C. (2) At least one of the following is satisfied: the polar parameter p of the Hansen solubility parameter (HSP) is 0p5.0, and the hydrogen-bond parameter h of the Hansen solubility parameter (HSP) is 9.8h4.0.

The application provides a high-temperature resistant glass dimming film, which has a multi-layer structure, wherein the multi-layer structure comprises from external to internal: a wear resistant layer, a thermal insulating layer, an ultraviolet-proof layer, an adhesive layer and a transparent base layer; wherein, a hollow layer is arranged between the wear resistant layer and the thermal insulating layer, the hollow layer comprises multiple heat dissipation channels and isolating bars, the multiple heat dissipation channels are arranged horizontally and the width and spacing between the multiple heat dissipation channels are identical.

A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 m and less than or equal to 0.10 m.

The invention relates to a panel, in particular a decorative panel, a floor panel, a ceiling panel or a wall panel. The invention also relates to a covering consisting of a plurality of mutually coupled panels according to the invention, in particular a floor covering consisting of a plurality of mutually coupled panels, according to the invention.