A conductive composition for bonding includes a mix of copper powder carboxylic acid. The carboxylic acid has a branched carbon chain. The copper powder comprises first and second copper particles. The first copper particles have a volume-based cumulative particle size D.sub.50 of 0.11 ?m or more and less than 1 ?m at a cumulative volume of 50 vol % in a region of particle sizes of less than 1 ?m in a particle size distribution of the copper powder. The second copper particles have a volume-based cumulative particle size D.sub.50 of 1 ?m or more and 10 ?m or less at a cumulative volume of 50 vol % in a region of particle sizes of 1 ?m or more in the particle size distribution of the copper powder. The carboxylic acid is contained in an amount of 6 parts or more and 24 parts or less per 100 parts by mass.

Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180? C. to 270? C. (2) At least one of the following is satisfied: the polar parameter ?p of the Hansen solubility parameter (HSP) is 0??p?5.0, and the hydrogen-bond parameter ?h of the Hansen solubility parameter (HSP) is 9.8??h?4.0.

A method of manufacturing a structural arrangement on the basis of a fiber reinforced polymer component, comprising at least the steps of: providing a fiber reinforced polymer component; fixing a polyether sulfone foil on the fiber reinforced polymer component, at least in a region where an electrically conductive layer is to be formed; and performing a cold gas spraying process for spraying electrically conductive particles onto the polyether sulfone foil in order to create the electrically conductive layer.

To suppress a decrease of strength, a bonding paste includes a copper particle, a solvent, and an additive composed of a phosphate ester. In the bonding paste, a content of the additive is in the range of 0.5% to 3.0% by mass both inclusive relative to a total of the bonding paste.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

A sheet assembly can be cut into one or more cards. The sheet assembly includes an upper layer configured to receive a first printing of first indicia for the one or more cards. The sheet assembly may further include a core coupled with the upper layer and a lower layer configured to receive a second printing of second indicia for the one or more cards. The lower layer is coupled with the core with the core disposed between the upper sheet and the lower sheet. One or more of the upper layer, the core, or the lower layer is formed from paper impregnated with a resin that includes a biobased resin.

This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.

A buffer structure, a preparation method for the buffer structure, and a display apparatus are provided. The buffer structure includes a substrate layer. A plurality of microporous structures are distributed in the substrate layer. The substrate layer is doped with electrically and thermally conductive materials. The electrically and thermally conductive material is distributed in the whole-layer structure of the substrate layer. The electrically and thermally conductive materials forms a heat conducting network structure in the substrate layer.

A laminated side glazing of a vehicle, with an upper edge, a lower edge, a front edge, and a rear edge, includes an outer pane and an inner pane, which panes are bonded to one another via a thermoplastic intermediate layer, and a transparent, heatable coating, which is arranged between the outer pane and the inner pane and which is electrically contacted by a first collecting busbar and a second collecting busbar and which has, for guiding a heating current flowing between the collecting busbars, at least one decoated isolating line that runs between the collecting busbars, wherein the first collecting busbar and the second collecting busbar are arranged along the front edge or the rear edge and wherein an upper part and a lower part are defined by pattern of decoated isolated lines different in the upper part and the lower part of the laminated side glazing.

A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.