The present disclosure relates to a decorative panel with a carrier plate comprising a multi-laminate plastic carrier material with a plurality N of layer sequences of the A-B-A type, wherein layer A comprises a first thermoplastic resin and layer B a second thermoplastic resin different from the thermoplastic resin of layer A and wherein N lies between ≥3 and ≤250.

A laminated body having at least two or more different layers, wherein the laminate body is characterized by satisfying the following requirements (1) to (5): (1) the laminate body has a heat-sealing layer as at least one of the outermost layers, wherein the heat-sealing layer includes a polyester based component containing ethylene terephthalate as a main constituent component, and a sealing strength of 8 N/15 mm to 30 N/15 mm; (2) at least one layer other than the heat-sealing layer is an inorganic thin film layer; (3) a water vapor permeation rate of 0.1 g/m.sup.2.Math.d to 6 g/m.sup.2.Math.d; (4) an oxygen permeation rate of 5 ml/m.sup.2.Math.d.Math.MPa to 30 ml/m.sup.2.Math.d.Math.MPa; and (5) a heat shrinkage rate of −5% to 5%.

Decorative panel, in particular a floor panel, ceiling panel or wall panel, including a core layer having an upper side and a lower side, a decorative top layer connected to said upper side of the core layer, a first panel side edge including a first coupling profile, and a second panel side edge including a second coupling profile designed to interconnect with a first coupling profile of a second, identical panel, both in horizontal direction and in vertical direction. The core layer includes a layer of foam concrete which is constituted by a matrix of concrete material in which air pockets in the form of cells are present.

Embodiments provide a multilayer film, including: a first acrylic resin layer (α1), an aromatic polycarbonate resin layer (β), and a second acrylic resin layer (α2), where the first acrylic resin layer (α1), the aromatic polycarbonate resin layer (β), and the second acrylic resin layer (α2) are directly laminated in the stated order, where a glass transition temperature of an aromatic polycarbonate resin constituting the aromatic polycarbonate resin layer (β) is 100-140° C., and where the following formulae (4-1) and (4-2) and the following properties (i) and (ii) are satisfied: (Tβ−Tα.sub.1)≤30 . . . (4-1), (Tβ−Tα2)≤30 . . . (4-2), (i) a total light transmittance of the multilayer film is 85% or more, and (ii) a retardation of the multilayer film is 75 nm or less; and where Tai is a glass transition temperature of an acrylic resin constituting the first acrylic resin layer (α1), Tae is a glass transition temperature of an acrylic resin constituting the second acrylic resin layer (α2), and Tβ is a glass transition temperature of an aromatic polycarbonate resin constituting the aromatic polycarbonate resin layer (β), and all temperature units are ° C.

A shielding device for shielding against weather influences that includes a textile sheet material which is stretched two-dimensionally or can be rolled out and which forms a shield against weather influences, in particular, against solar radiation and/or rain. The textile material has warp threads and weft threads connected together in a lattice-like manner so as to form a fabric. A foam layer which has foam pores that are separated from one another by solid foam walls is applied onto the textile sheet material on at least one side of the textile sheet material.

A polyolefin microporous film having a laminated structure provided with at least one layer A containing a polyolefin and at least one layer B containing a polyolefin. 0 mass % to less than 3 mass % of polypropylene is contained in layer A and 1 mass % to less than 30 mass % of polypropylene is contained in layer B. When the proportion of polypropylene contained in layer A is represented by PPA (mass %) and the proportion of polypropylene contained in layer B is represented by PPB (mass %), PPB>PPA. In the polyolefin microporous film, the heat shrinkage ratio in TD at 120° C. measured upon applying, in MD, a constant load determined on the basis of the relationship: load (gf)=0.01×piercing strength (gf) of polyolefin microporous film×length (mm) in TD of polyolefin microporous film, is 10 to 40% inclusive.

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

A bearing laminate can include a metal support layer, a foam layer overlying the metal support layer, the foam layer including a polymeric foam; and a sliding layer overlying the polymeric foam layer, the sliding layer comprising a polymer matrix. Bearing articles made from the bearing laminate can have exceptional damping properties, such as a high damping ratio combined with a low dynamic stiffness.

The invention provides a polyolefin-based resin film including a polyolefin-based resin composition that includes at least a propylene-α olefin random copolymer, wherein (1) an olefin-based block copolymer is 0 to 2 parts by weight based on 100 parts by weight of the propylene-α olefin random copolymer; (2) an olefin-based copolymeric elastomer resin is 0 to 2 parts by weight based on 100 parts by weight of the propylene-α olefin random copolymer; (3) a propylene homopolymer is 0 to 40 parts by weight based on 100 parts by weight of the propylene-α olefin random copolymer; (4) the polyolefin-based resin film exhibits a thermal shrinkage rate of 25% or less in a direction in which the thermal shrinkage rate is larger between a longitudinal direction and a lateral direction; and (5) a planar orientation coefficient ΔP calculated from a refractive index of the polyolefin-based resin film is 0.0100-0.0145.

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.
0.12<{(a1+a2)/2}/B  (1)
0.8≤a1/a2≤1.25  (2)