An assembly to repair a thermoplastic composite. The assembly includes a heating device positioned on opposing sides of the thermoplastic composite. The heating device includes one or more susceptor with a Curie temperature to heat the thermoplastic composite. A pressure device applies a compressive force to the heating device. A pressure distribution device is positioned between the heating device and the thermoplastic composite. The pressure distribution device distributes the compressive force from the pressure device over areas of the opposing sides of thermoplastic composite.

Provided is a laminate sheet in which, on one surface of a resin layer having optical transparency, a colored layer and a backing layer are sequentially laminated, and on the other surface of the resin layer, a pattern layer made of an ionizing radiation curable resin and having optical transparency is laminated. The pattern layer has a softening temperature of 140 to 160 C., and the resin layer, the colored layer, and the backing layer have softening temperatures of 120 C. or lower. The surface of the pattern layer has a concavo-convex shape and the thickness thereof is continuously varied.

Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.

A method comprising providing a polymeric substrate having a melting point of from about 130 C. to about 190 C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100 C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

The present invention relates to a composition comprising: a) one or more organometallic compounds; b) one or more high boiling point solvents; and c) one or more low boiling point solvents. The invention further relates to a system comprising a) one or more organometallic compounds; b) one or more high boiling point solvents; and c) one or more low boiling point solvents and an isocyanate functional adhesive. The isocyanate functional adhesive may be a one part or a two part adhesive. The invention further relates to methods of bonding substrates together using the compositions of the invention.

The invention regards a press for soldering multilayer stacks for printed circuits, with an outer muffle that encloses soldering chambers where multilayer stacks are arranged to be heated, inducing a magnetic flux. For such purpose, the press is provided with an inductor having winding form which is arranged on a mobile piston adapted to apply a force on the multilayer stack, such to generate a magnetic flux at its interior that is spatially uniform and regular over time.

Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.

A method of forming a skin-foam-substrate type structure particular suitable as an automobile trim component. The method comprises supplying a polymer resin containing a chemical foaming agent and including metal particles capable of inductive heating, that is positioned between a polymeric skin and substrate, followed by inductive heating to cause foaming of the polymeric resin. The foamed polymer resin adheres to the skin and substrate.

A method comprising providing a polymeric substrate having a melting point of from about 130 C. to about 190 C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100 C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

The present invention relates to a composition comprising: a) one or more organometallic compounds; b) one or more high boiling point solvents; and c) one or more low boiling point solvents. The invention further relates to a system comprising a) one or more organometallic compounds; b) one or more high boiling point solvents; and c) one or more low boiling point solvents and an isocyanate functional adhesive. The isocyanate functional adhesive may be a one part or a two part adhesive. The invention further relates to methods of bonding substrates together using the compositions of the invention.