Disclosed is a thermal transfer substrate including a base substrate and a touch module on the base substrate. A side of the touch module which is in contact with the base substrate is adhesive, the adhesiveness decreasing under a first condition while increasing under a second condition. The present disclosure solves the problem that the manufacturing yield rate of touch display panels is relatively low, and improves the manufacturing yield rate of the touch display panels. The present disclosure is used for manufacturing a touch display panel.

The present invention aims to provide a conductive layered body having excellent solvent resistance and scratch resistance as well as a low haze value and a significantly high light transmittance. The present invention relates to a conductive layered body including, as an outermost layer thereof, a conductive layer containing a conductive fibrous filler, wherein the conductive layered body has a Martens hardness of 150 to 3,000 N/mm.sup.2 as measured at an indentation depth of 100 nm from a surface, and a ratio, in atomic percentage, of a conductive material element constituting the conductive fibrous filler on an outermost surface-side surface of the conductive layer is 0.15 to 5.00 at %.

The present application provides a method of fabricating a stretchable electronic device. The method includes forming an elastomer polymer layer on a base substrate; selectively stiffening the elastomer polymer layer in a plurality of defined regions of the elastomer polymer layer, thereby forming a modified elastomer polymer layer having a plurality of stiffened portions respectively in a plurality of stiffened regions spaced apart by one or more elastomeric portions in one or more elastomeric regions, the plurality of stiffened portions having a Young's modulus greater than a Young's modulus of the one or more elastomeric portions; and forming a plurality of electronic devices respectively in the plurality of stiffened regions, each of the plurality of electronic devices formed on a side of one of the plurality of stiffened portions distal to the base substrate.

Method and composition for switchable panels are disclosed. Switchable films are placed between glass and liquid resin is injected between the glass and cured. The panels may be used for a wide variety of applications.

The present disclosure provides a display module, a method for fabricating the same, and a display panel comprising the same. The display module comprises a flexible display panel and a support film. The flexible display panel comprises a display area and a non-display area. The support film comprises a first support film disposed below the display area, and a second support film disposed below the non-display area and composed of a cured organic material. Because the organic material has good fluidity and adhesiveness, gas between the flexible display panel and the second support film can be effectively discharged. This prevents air bubbles from being generated between the flexible display panel and the second support film.

An inkjet print apparatus includes a stage; an inkjet head located over an upper portion of the stage, configured to move in a first direction and a second direction opposite to the first direction, and configured to eject an ink toward the stage; a first ultraviolet irradiator located behind the inkjet head with respect to the first direction first covers located at respective sides of the first ultraviolet irradiator in the first direction; a second ultraviolet irradiator located behind the inkjet head with respect to the second direction; and second covers located at respective sides of the second ultraviolet irradiator in the second direction. Further, a process for forming an adhesive layer may be simplified by using an inkjet printing method.

A method for manufacturing a flow path device internally provided with a flow path for allowing a liquid to flow by compression bonding two or more members to each other, in which the hydrophilic property of a surface of the flow path can be maintained for a long period of time. A flow path device is manufactured by forming a hydrophilic coating film using a treatment liquid including a hydrophilizing agent in at least one member, the coating film covering a surface of the member at a side to be joined to another member, then irradiating only a joining surface of the coating film with ultraviolet rays or plasma derived from an oxygen-containing gas in the member having the coating film, and irradiating at least the joining surface with ultraviolet rays or plasma derived from an oxygen-containing gas in a member having no coating film, and compression bonding the two or more members.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A panel may include at a substrate and a top layer provided on the substrate. The top layer may include a motif and a transparent or translucent synthetic material layer provided above the motif. The motif may be a print formed by digitally applying inks on the substrate with the intermediary of one or more primer layers extending underneath the print. The transparent or translucent synthetic material layer may include polypropylene and have a thickness of less than 1 millimeter.

A method of manufacturing a glass assembly to have a conductive feature includes a step of forming a glass substrate that is curved. The method also includes digitally-applying a conductive ink without a mask onto a surface of the curved glass substrate. The method further includes curing the conductive ink to form the conductive feature on the surface of the curved glass substrate, with the conductive feature having a resolution of greater than 200 dots per inch.