An optical adhesive sheet having an excellent repulsion resistance and an excellent swelling rate, and a method for manufacturing the same.

The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

The present disclosure relates to a method to produce a coating layer, including applying a coating composition on a surface of a carrier, curing the coating composition to a coating layer, and subsequently applying pressure to the coating layer. The disclosure further relates to a method to produce a building panel, and such a building panel, and to a method to produce a coated foil, and such a coated foil.

A stone plastic composite (SPC) floor includes a decorative surface. The SPC floor has an SPC substrate and a decorative surface formed on the SPC substrate; the decorative surface is a wooden board or a bamboo board; the moisture content of the decorative surface is controlled within 5-7%. The SPC substrate is divided into an upper layer, a middle layer, and a lower layer, and the main components of the SPC substrate comprise polyvinyl chloride resin powder, calcium carbonate, a calcium-zinc stabilizer, an inner lubricant, PE wax, chlorinated polyethylene (CPE), acrylic ester (ACR), a composite lubricant, and a coloring agent. The SPC floor can ensure that the decorative surface does not wrap and deform, and other performances of the floor are not affected, and thus is low in costs.

A manufacturing apparatus (10) for manufacturing a semiconductor device includes: a wafer holding device (12), a PU device (14) having a PU head (40) that holds a target chip (100) in a non-contact manner, an energy irradiation device (16) irradiating energy to the target chip (100) from a back surface side of a dicing tape (130) to reduce an adhesive force of the dicing tape (130), and a controller (22). An adhesive layer of the dicing tape (130) is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip (100) by a small distance. The controller (22) controls a position of the PU head (40) so that the target chip (100) and the PU head (40) do not come into contact with each other even if the target chip (100) floats during a takeoff preparation period.

A method of assembling components includes the steps of providing a stamp, providing a component disposed on an adhesive surface, pressing the stamp against the component to adhere the component to the stamp, pulling the stamp away from the adhesive surface, and removing the component from the adhesive surface with the stamp. The adhesive surface can deform in a direction of the stamp and can enable progressive delamination of the adhesive surface from a bottom of the component from an edge or corner of the component toward a center of the component, thereby reducing the instantaneous adhesive force between the component and at least a portion of the adhesive surface. The method can enable the transfer and assembly of many millions of small and fragile components per hour with excellent precision from a tape to a target substrate.