Patent classifications
B32B2310/0843
Method and Device for Separating Workpiece Consisting of Carrier Substrate and Resin Layer
A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.
LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
According to one embodiment, in a semiconductor device, a first film is arranged on a side of a main surface of the substrate. A second film is arranged on an opposite side of the substrate with the first film interposed therebetween. A main surface of the second film is in contact with a main surface of the first film. A third film is arranged on an opposite side of the first film with the second film interposed therebetween. A main surface on a side of the substrate of the third film has two-dimensionally-distributed protrusions or recesses. A main surface on an opposite side of the substrate of the third film is flat. Absorptance of infrared light of the second film is higher than absorptance of the infrared light of the third film. Thermal expansion coefficient of the third film is different from thermal expansion coefficient of the second film.
Method of Manufacturing Anti-Theft Labels
A system and method for manufacturing a strip or label used to place a substantially invisible identifying mark is disclosed. A strip is treated by removing at least one area of a liner element, a film layer and an adhesive layer. Each one of the removed areas is substantially congruent with the other removed areas. A laser or other ablating device is used to remove the areas through vaporization. The strip element is peeled away from the liner element, exposing the adhesive layer. The adhesive layer is thereafter pressed against a substantially flat metal surface. The laminate top coat and the film layer are removed from the object, leaving the adhesive layer in place. The adhesive material is impregnated with a UV sensitive material, but is otherwise invisible.
STRETCHABLE ELECTRO-OPTIC DISPLAYS
A stretchable electro-optic display includes a layer of conductive material and an electrophoretic medium laminated to the layer of conductive material. The layer of conductive material also includes a plurality of nodes and a stretchable interconnect connecting first and second nodes of the plurality of nodes. A method of manufacturing a stretchable electro-optic display is also provided that includes patterning a layer of conductive material to define a plurality of nodes and a stretchable interconnect connecting first and second nodes of the plurality of nodes and laminating a layer of an electrophoretic medium to the layer of conductive material.
LAMINATE PRODUCTION METHOD, SUBSTRATE PROCESSING METHOD, AND LAMINATE
A production method of a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including a release layer forming step of coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.
METHOD FOR MANUFACTURING A TRANSLUCENT OR TRANSPARENT VEHICLE PART
A method for manufacturing a vehicle part, including the steps of applying a paint layer on a first face of a transparent or translucent part, applying a varnish layer on the paint layer, partially irradiating the paint layer and the varnish layer with laser radiation so as to etch the paint layer and the varnish layer, and overmolding a semi-transparent film on a second face of the transparent or translucent part opposite the first face.
METHOD FOR MANUFACTURING A TRANSPARENT OR TRANSLUCENT VEHICLE PART
A method for manufacturing a vehicle part, including the steps of a) overmolding a semi-transparent film on a transparent or translucent part, b1) applying a paint layer on the semi-transparent film, b2) applying a varnish layer on the paint layer, and b3) partially irradiating the paint layer and the varnish layer with laser radiation so as to etch the paint layer and the varnish layer, step a) being implemented before step b1) or after step b3).
METHODS AND APPARATUS FOR MANUFACTURING OPTIMIZED PANELS AND OTHER COMPOSITE STRUCTURES
The disclosure relates to additively manufactured (AM) composite structures such as panels for use in transport structures or other mechanized assemblies. An AM core may be optimized for an intended application of a panel. In various embodiments, one or more values such as strength, stiffness, density, energy absorption, ductility, etc. may be optimized in a single AM core to vary across the AM core in one or more directions for supporting expected load conditions. In an embodiment, the expected load conditions may include forces applied to the AM core or corresponding panel from different directions in up to three dimensions. Where the structure is a panel, face sheets may be affixed to respective sides of the core. The AM core may be a custom honeycomb structure. In other embodiments, the face sheets may have custom 3-D profiles formed traditionally or through additive manufacturing to enable structural panels with complex profiles. The AM core may include a protrusion to provide fixturing features to enable external connections. In other embodiments, inserts, fasteners, or internal channels may be co-printed with the core. In still other embodiments, the AM core may be used in a composite structure such as, for example a rotor blade or a vehicle component.
Methods and apparatus for manufacturing optimized panels and other composite structures
The disclosure relates to additively manufactured (AM) composite structures such as panels for use in transport structures or other mechanized assemblies. An AM core may be optimized for an intended application of a panel. In various embodiments, one or more values such as strength, stiffness, density, energy absorption, ductility, etc. may be optimized in a single AM core to vary across the AM core in one or more directions for supporting expected load conditions. In an embodiment, the expected load conditions may include forces applied to the AM core or corresponding panel from different directions in up to three dimensions. Where the structure is a panel, face sheets may be affixed to respective sides of the core. The AM core may be a custom honeycomb structure. In other embodiments, the face sheets may have custom 3-D profiles formed traditionally or through additive manufacturing to enable structural panels with complex profiles. The AM core may include a protrusion to provide fixturing features to enable external connections. In other embodiments, inserts, fasteners, or internal channels may be co-printed with the core. In still other embodiments, the AM core may be used in a composite structure such as, for example a rotor blade or a vehicle component.