Patent classifications
B32B2310/0881
BONDING OF SUBSTRATES INDUCED BY IONIZING RADIATION
A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.
Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate
The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.
Bonding of substrates induced by ionizing radiation
A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.
Bonding of substrates induced by ionizing radiation
A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.
BONDING OF SUBSTRATES INDUCED BY IONIZING RADIATION
A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.
Method and arrangement for manufacturing a radiation window
In a method for manufacturing a radiation window there is produced a layered structure where an etch stop layer exists between a carrier and a solid layer. A blank containing at least a part of each of the carrier, the etch stop layer, and the solid layer is attached to a radiation window frame. At least a part of what of the carrier was contained in the blank is removed, thus leaving a foil attached to the radiation window frame, wherein the foil contains at least a part of each of the etch stop layer and the solid layer.
Substrate bonding method and substrate bonding system
A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activation treatment step, exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time, and a bonding step of bonding the two substrates that have the bonding surfaces activated in the activation treatment step.