Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.

Methods, apparatus and system for decorating plastic articles having an uneven surface or hollow structure are disclosed. An assembly comprising a transfer pad and a flexible heat transfer die comprising a thermal interface material (TIM) replace the hard rubber die in a hot-stamping process to fuse indicia into the surface. The assembly modifies ordinary pad printing into a hot-stamping process that transfers indicia onto uneven surfaces. A pad printing machine or other robotics is used to move the assembly from a position of heating to a position of compressing the ink transfer to the surface of the article.

A hot foil stamping press (10) comprises a platen press (16), with a supporting plate (22) comprising a base plate (26) and a compensating plate (28) being rotatably attached to the base plate (26) for switching between an operating position and a makeready position and a hook element (38) comprising a base part and a top part being arranged at an angle relative to the base part. The hook element (38) is rotatably attached to a door (30) of the platen press (16) by a fixation axle for switching between a releasing position and a securing position of the hook element, wherein the top part retains the compensating plate (28) in its makeready position when the hook element (38) is in its securing position.

An illustrative heating section in a dye sublimation apparatus may include one or more individually controllable fans. More specifically, a computer or a controller may control speed and/or orientation of the fans for a convective heat transfer to a printed sheet in the heating section. Furthermore, the speed and/or orientation of the fans may be dynamically adjusted based upon the temperature requirement of different stages of the dye sublimation process. Compared to the conventional systems that rely only upon radiative heat which generally results in non-uniform heat distribution within the heating section, the embodiments disclosed herein generate a uniform or nearly uniform heat distribution and also avoid hot spots within the heating section.

A holographic foil supplying device for a hot foil stamping machine has a reel (26) for holographic foil (20), an advancement system (24) for advancing the holographic foil (20) along a movement path (P) in a feeding direction (F) and a frame (22) supporting the reel (26) and the advancement system (24), wherein the frame (22) comprises a mount (30) for mounting the holographic foil supplying device (18) to the hot foil stamping machine. Further, a hot foil stamping machine is shown.

The device for hot stamping a part of a vehicle body is provided. The device includes a strip including a carrier film and a decorative film; at least one motorized arm capable of moving; at least one head mounted movably in rotation on one end of the arm, the head comprising pressure means capable of applying pressure on the strip; and means for unwinding the strip in front of the head.

A device for marking a conductor includes: a gripper for gripping the conductor extending in a longitudinal direction; a heating jaw assembly having two jaws spaced from each other in an open position in a first transverse direction transverse to the longitudinal direction; and a transport mechanism for dispensing a foil tape extending along the first transverse direction on a first side of the heating jaw assembly, a foil side of the foil tape facing away from the heating jaw assembly being weldable by heat and a foil side of the foil tape facing the heating jaw assembly including a marking of the conductor; and a gripper mechanism for moving the gripper along a second transverse direction transverse to the longitudinal direction and transverse to the first transverse direction when the heating jaw assembly is in the open position. The gripper moves the gripped conductor.

A lower mandrel for a cap logo applicator includes a structure having a curved surface and a first end and a second end, an extension extending from the first end to the second end, and a first pad positioned on an upper surface of the structure. The first pad extends radially beyond both the first end and the second end and below a lower surface of the structure.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

An illustrative dye sublimation apparatus may include a texture sheet with a pattern to be applied to a substrate. More specifically, the texture sheet is pressed into the substrate during the dye sublimation process in order to apply the pattern from the texture sheet while the substrate is heated and simultaneously being infused with an image from a printed sheet. The pressure applied to the texture sheet can vary, for example based on the temperature. Compared to the conventional systems in which substrates are pre-textured, the embodiments disclosed herein describe a process for simultaneous image-infusion and texture-application, which results in a substrate that is both infused and textured.