The disclosure discloses a foil stamping mechanism, which includes a base and a lifting seat, wherein a plurality of stamping molds are arranged between the base and the lifting seat, an aluminum foil driving mechanism is arranged above the stamping mold, the aluminum foil driving mechanism includes a connecting plate, a monitoring device is installed on one side of the connecting plate. According to the disclosure, a pattern on an electrochemical aluminum foil can be precisely stamped to a corresponding position on a film roll.

A coupon wafer comprising a device coupon (110) for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate (124), and the device coupon (110) is attached to the wafer substrate via a tether (122) and the tether (122) is formed from a dielectric material.

The present disclosure relates to a heat press, especially knee lever-transfer press with at least one socket, with at least one base plate and with at least one heatable counter plate pivotable towards the base plate, wherein the knee lever-transfer press further has a control unit, by which the knee lever-transfer press is controllable in an open-loop manner and/or closed-loop manner and wherein the control unit constitutes a first modular unit of the knee lever-transfer press and wherein the socket constitutes at least one second modular unit, and the base plate and the counter plate constitute at least one third modular unit and wherein at least the first modular unit and the second modular unit and/or the third modular unit are separable from each other and/or are formed to be replaceable for functional comparable modular units.

Printing machine (10) of the blocking press type, comprising a heating block (12) which comprises a curved carrier medium surface (13) of a printing plate, an application head (14) comprising means of guidance of the heating block in a tilting motion, and an actuator (18) for tilting of the heating block relative to the application head.

A micro-transfer printing system comprises a source substrate having a substrate surface and components disposed in an array on, over, or in the substrate surface Each component has a component extent in a plane parallel to the substrate surface. A stamp comprises a stamp body and stamp posts extending away from the stamp body disposed in an array over the stamp body. Each of the stamp posts has (i) a post location corresponding to a component location of one of the components when the stamp is disposed in alignment with the source substrate, and (ii) a post surface extent on a distal end of the stamp post. The post surface extent is greater than the component extent.

A heat press device is provided that includes a support structure, a first platen and a heating element assembly that includes a heating element and a second platen. The heat press device further includes a movement assembly configured to change a pressure state between the first platen and the second platen when the heat press device is in a closed configuration. The heat press device can also include an indicator that is configured to convey the pressure state between the first platen and the second platen when the heat press device is in the closed configuration.

A heat press for decorating substrates includes a support frame, a lower platen assembly supported on the support frame, and a linkage assembly having at least an upper link arm pivotally coupled with the support frame for movement to and between first and second positions. An upper platen assembly is coupled with the support frame by the linkage assembly for movement relative to the lower platen assembly to and between an open condition away from the lower platen assembly, and a closed condition adjacent the lower platen assembly, as the upper link arm is moved to and between the first and second positions. A linear actuator cooperates with the linkage assembly to further move the upper platen assembly in the closed condition in a direction to clamp an upper platen against a lower platen by moving an actuator rod from an extended position toward a retracted position.

A process and apparatus for sublimating printed images onto two or more products substantially simultaneously are disclosed. Software components are configured to receive input of a desired number of products to sublimate, and then determine a spatial arrangement of the printed images on transfer media to sublimate the desired number of products substantially simultaneously. The apparatus is configured to print the images onto the media according to the spatial arrangement, then position the media onto a substrate. The products are automatically placed on the media proximate to their corresponding printed images. The apparatus manipulates the media to substantially surround the products and places at least one image onto each side of each product to be sublimated. One or more heating platens engage the media to sublimate the images. The heating platens are configured, using a control, to sublimate multiple products substantially simultaneously in a single thermal cycle.

Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.

A heat press including a body, a heat plate, a handle, a cover, a control compartment and an insulation portion. The body includes a first end and a second end. The heat plate is located proximate the first end of the body and is configured to engage ironable materials. The handle is located proximate the second end of the body and is configured to withstand forces from a user. The cover covers a portion of the body and the handle. The control compartment includes an electrical circuit, controls and a display. The control compartment is spaced away from and is at least indirectly electrically coupled to the heat plate. The insulation portion is positioned between the control compartment and the heat plate. The insulation portion includes a first layer of insulating material.