B41J11/55

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
20230137402 · 2023-05-04 ·

The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus provided includes a stage extending in a first direction, for moving a substrate in the first direction, and having an air floating system, a gantry arranged on the stage to extend in a second direction crossing the first direction, a head module installed on the gantry and movable in the second direction, and a displacement sensor installed in the head module, for measuring a separation distance between the substrate and stage, wherein at a first position, the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage, and at a second position that is different from the first position, the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
20230133599 · 2023-05-04 ·

The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus provided includes a stage extending in a first direction, for moving a substrate in the first direction, and having an air floating system, a gantry arranged on the stage to extend in a second direction crossing the first direction, a head module installed on the gantry and movable in the second direction, and a displacement sensor installed in the head module, for measuring a separation distance between the substrate and stage, wherein at a first position, the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage, and at a second position that is different from the first position, the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.

Substrate treating apparatus and substrate treating method using the same
11964471 · 2024-04-23 · ·

The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus provided includes a stage extending in a first direction, for moving a substrate in the first direction, and having an air floating system, a gantry arranged on the stage to extend in a second direction crossing the first direction, a head module installed on the gantry and movable in the second direction, and a displacement sensor installed in the head module, for measuring a separation distance between the substrate and stage, wherein at a first position, the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage, and at a second position that is different from the first position, the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.

Substrate treating apparatus and substrate treating method using the same
11964471 · 2024-04-23 · ·

The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus provided includes a stage extending in a first direction, for moving a substrate in the first direction, and having an air floating system, a gantry arranged on the stage to extend in a second direction crossing the first direction, a head module installed on the gantry and movable in the second direction, and a displacement sensor installed in the head module, for measuring a separation distance between the substrate and stage, wherein at a first position, the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage, and at a second position that is different from the first position, the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.