To provide: a guide roller, whereby a replacement operation time can be shortened, guide roller position adjustment operations are not needed, and an equipment stop time can be reduced, and which contributes to suppression of productivity deterioration; and a substrate transfer apparatus provided with the guide roller. A substrate transfer apparatus (1) is provided with transfer rollers (3); a plurality of transfer shafts (2) that are provided with the transfer rollers (3); a guide roller (5) that guides a substrate (10); and a roller holding section (6) having a supporting shaft (62) that supports the guide roller (5) at one end. A contact section (52) of the guide roller (5) in contact with the substrate (10) can be separated from other sections (a base section (51) and a nut section (53)).

An apparatus for picking and placing a plate-like product comprises: a base; at least two guide rods disposed on said base vertically; a picking and placing device mounted on each of said guide rods vertically slidably, the picking and placing device is telescopic in a horizontal direction to smoothly and steadily pick and place the plate-like product; a driving device disposed on said base, said driving device connects with said picking and placing device for driving said pick and place device to slide along the respective guide rods.

Systems for safety grip control of telescoping sheet lifters are provided. The systems incorporate at least one load interlock element and at least two alignment interlock elements joined to a carrying angle of the telescoping sheet lifter. The load interlock element detecting the presence of a load on the sheet lifter. The alignment interlock elements detecting the alignment of the load on the sheet lifter. The systems define three different load conditions: empty lifter, properly aligned sheets, and misaligned sheets. Corresponding or associated methods are also provided.

The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

A substrate treating apparatus including an unloading order changing unit. The unloading order changing unit reverses an order, in regard to unloading of substrates in a carrier from the top, between a poor inclined substrate and a substrate at least immediately above the poor inclined substrate when the poor inclined substrate is present whose inclination is determined larger than a pre-set threshold by a poor inclination determining unit. That is, the order is reversed such that the poor inclined substrate whose surface may be possibly be scratched with a hand is unloaded prior to the substrate immediately above the poor inclined substrate. Accordingly, this inhibits damages on the substrate caused by scratching a substrate surface with the hand of a substrate transport mechanism.

An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.

Apparatus and method for transferring a substrate are disclosed. The substrate transfer apparatus includes: a substrate conveyance assembly disposed between a mechanical arm and a wafer stage, the substrate conveyance assembly including a substrate loading conveyor and a substrate unloading conveyor parallelly arranged in a first direction, each of the substrate loading conveyor and the substrate unloading conveyor configured for transferring a substrate between the wafer stage and the mechanical arm along a second direction perpendicular to the first direction; an integral frame; and a transition air suspension assembly fixed to the integral frame at the end thereof proximal to the wafer stage, the transition air suspension assembly being able to engage with either of the substrate loading conveyor and the substrate unloading conveyor for producing an air film to levitate the substrate during the conveyance of the substrate by the substrate loading conveyor or the substrate unloading conveyor.

In an apparatus for overturning sheets and/or panels, a bearing structure carries a loading plane, and roto-translation means vertically translate the loading plane and rotate the same with respect to an axis. A grab device carried by the loading plane serves to transfer a sheet and/or panel from a supply station, when stopped upstream of the apparatus, on an operating surface. A command and control unit in alternatively activating and de-activating the roto-translation means, the stabilization and transfer and the grab device, defines for the loading plane a collection position, an overturning position and an unloading position of a sheet and/or panel to be overturned by the supply station placed upstream of the apparatus, over an unloading station downstream of the apparatus.

An end-of-arm tool is described and includes an outer sheet and an inner sheet. The end-of-arm tool may be reinforced with a backing plate attached to the inner sheet and a front plate attached to the outer sheet. The end-of-arm tool may also include spacers to provide structure and rigidity to the end-of-arm tool at passages configured for the installation of workpiece interface tools, for example, spring plungers.

A bonding apparatus and a bonding method, the bonding apparatus includes at least one first bonding device, at least two second bonding devices and a transferring device. The first bonding device is configured to visually align and bond an optically clear adhesive and a first component, to form a first bonding component. The transferring device is configured to transfer the first bonding component to the second bonding device. The second bonding device is configured to visually align and bond the first bonding component and a second component, to form a second bonding component.