A modular conveying assembly includes active roller control for reducing backline pressure without product to product contact when accumulating products. Methods are discussed for manipulating objects by a bump-through indexing operation, a slug-control indexing operation, a catch-and-release indexing operation, box or case turning operations, and zero-pressure accumulation operations.

A container-handling device includes two rotors, holders that are arranged around a periphery of the first rotor and receptacles around the first rotor such that as it rotates, the receptacles pass through distinct angular ranges. When a receptacle has a container, relative movement therebetween causes its centering element and its counter-bearing to clamp a container between them with the holder engaging the container above the counter-bearing A first partial-stroke occurs while the receptacle is in a first angular region and a second partial-stroke occurs after the receptacle has left the first angular region. During the first partial-stroke, the centering element bears against a container's mouth with a pressure, and, during the second partial-stroke, this pressure increases.

A method for changing the alignment of articles in a conveying flow, wherein, by a rotary projection projecting into the conveying path of a conveyor of a material handling system, the alignment of the article is achieved via the force of the conveying flow, and the conveying flow runs obliquely in front of the rotary projection in relation to the direction thereof, in order to ensure the contacting of the article on the rotary projection. The rotary projection is configured such that it can move in a transverse manner in relation to the conveying flow, in such a way that the extension thereof into the conveying flow is variable, wherein the scale of the extension of the rotary projection into the conveying flow is determined based on the respective article.

A system, and associated method, for launching and delivering separated food product in organized groups to a robotized packaging station for the product. The system initiates the delivery via a metered hopper of food product delivering the product to a launch V-belt that aligns the product end to end. A successive singulator belt, positioned adjacent to and receiving product from the launch belt, further organizes the product into a single file alignment. An optional separator belt may follow the singulator belt to create gaps between successive product units. The product is then delivered to a pick belt for product to be provided to the packaging robot. The system product information is from a single (per product delivery line) sensor, enabling intergrated end-to-end control from hopper to robot, and a nearly continuous motion of said pick belt.

A modular conveying assembly includes active roller control for reducing backline pressure without product to product contact when accumulating products. Methods are discussed for manipulating objects by a bump-through indexing operation, a slug-control indexing operation, a catch-and-release indexing operation, box or case turning operations, and zero-pressure accumulation operations.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

An apparatus for transporting a case along a conveyor moving in a transport direction includes an engagement plate for positive engagement with the case. The engagement plate has a planar face and a vacuum source for vacuum attachment to a case outer surface face. The apparatus further includes a mechanism for moving the plate in the transport direction and for rotating the plate a selected angle from the transport direction. Related, corresponding, or associated methods for transporting a case along a conveyor moving in a transport direction are also disclosed.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the water based on the comparison.

The present application proposes an improved position sensor, a conveying device comprising the same and a method for position correction by using the same. The position sensor includes at least two light emitters, a light receiver array and a pedestal, the pedestal having a central plane and at least two sloping surfaces tilting towards a center of the pedestal at opposite edges, the at least two light emitters being arranged on the at least two sloping surfaces respectively, and the light receiver array being arranged on the central plane of the pedestal.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.