A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

Proposed is a MEMS device comprising a layer stack having at least one second layer formed between a first layer and a third layer. A cavity is formed in the second layer. The MEMS device further comprises two laterally deflectable elements arranged laterally spaced apart in the cavity. Each of the two laterally deflectable elements comprises a respective end connected to a side wall of the cavity. Additionally, the MEMS device comprises a connecting element connected to the two laterally deflectable elements to couple the movement of the two laterally deflectable elements. A plurality of first fingers are arranged discretely spaced between the two laterally deflectable elements on the side wall of the cavity. Further, a plurality of second fingers are arranged discretely spaced between the two laterally deflectable elements on the connecting element. The plurality of second fingers interdigitate with the plurality of first fingers. Further, the plurality of second fingers are laterally displaceable relative to the plurality of first fingers upon deformation of the two laterally deflectable elements such that the plurality of first fingers and the plurality of second fingers define a plurality of volume variable sub-cavities within the cavity. Each of the plurality of sub-cavities is in contact with an ambient fluid of the MEMS device via a respective opening. In case of adjacent sub-cavities of the plurality of sub-cavities, the respective opening of one sub-cavity of the adjacent sub-cavities is formed in a different layer of the first layer, the second layer and the third layer than the opening of the other sub-cavity of the adjacent sub-cavities.

A microstructure for use in a micro electro-mechanical device comprises a substrate having a top surface and a rear surface and a thin-film structure arranged at the top surface of the substrate. The thin-film structure comprises a raised portion spaced from the substrate, a lower portion of the thin-film structure, which is in mechanical contact with the substrate, at least one protruding portion, the protruding portion being hollow and having at least one sidewall and a bottom part and the protruding portion mechanically connecting the raised portion to the substrate via the bottom part, and at least one further sidewall of the thin-film structure at a distance to the at least one protruding portion, wherein the further sidewall mechanically connects the lower portion with the raised portion of the thin-film structure.

A method for manufacturing a micromechanical timepiece part starting from a silicon-based substrate, including, providing a silicon-based substrate, forming pores on the surface of at least one part of a surface of the silicon-based substrate of a depth of at least 10 μm, preferably of at least 50 μm, and more preferably of at least 100 μm, the pores being designed in order to open out at the external surface of the micromechanical timepiece part. A micromechanical timepiece part including a silicon-based substrate which has, on the surface of at least one part of a surface of the silicon-based substrate, pores of a depth of at least 10 μm, preferably of at least 50 μm, and more preferably of at least 100 μm, the pores being designed in order to open out at the external surface of the micromechanical timepiece part.

Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a first dielectric layer formed over the substrate. The semiconductor device structure also includes a first movable membrane formed over the first dielectric layer. In addition, the first movable membrane has a first corrugated portion and a first edge portion connecting to the first corrugated portion. The semiconductor device structure further includes a second dielectric layer formed over the first movable membrane. In addition, the first edge portion is sandwiched between the first dielectric layer and the second dielectric layer, the first corrugated portion is partially sandwiched between the first dielectric layer and the second dielectric layer and is partially exposed by a cavity, and a bottom surface of the first corrugated portion is lower than a bottom surface of the first edge portion.

A microelectromechanical system includes a spacer layer, a first corrugated conductive diaphragm, and a second corrugated conductive diaphragm. The spacer layer includes counter electrode walls, slots and support walls extending along a first direction. The counter electrode walls, slots and support walls are arranged alternately in a second direction. The first corrugated conductive diaphragm includes first crests and first troughs arranged alternately in the second direction. The second corrugated conductive diaphragm includes second crests and second troughs arranged alternately in the second direction. The spacer layer is received in a cavity formed by the first and second corrugated conductive diaphragms. The support walls are respectively sandwiched between the aligned first troughs and second crests. The counter electrode walls are respectively suspended in the corresponding chambers formed between the aligned first crests and second troughs. The microelectromechanical system of the present disclosure has a high level of acoustic compliance and sensitivity.

Structures and formation methods of a semiconductor device structure are provided. The method includes forming a first dielectric layer over a substrate and forming a first recess in the first dielectric layer. The method also includes conformally forming a first movable membrane over the first dielectric layer. In addition, the first movable membrane has a first corrugated portion in the first recess. The method further includes forming a second dielectric layer over the first movable membrane and partially removing the substrate, the first dielectric layer, and the second dielectric layer to form a cavity. In addition, the first corrugated portion of the first movable membrane is partially sandwiched between the first dielectric layer and the second dielectric layer.

A MEMS device includes a body pivoting around a pivot axis, a support, and a suspension structure mechanically coupling the body to the support. The suspension structure includes a torsion element defining the pivot axis, and first and second spring elements extending with an angle relative to the pivot axis on opposing sides of the torsion element so that a distance between at least portions of the first and second spring elements is changing in the direction of the pivot axis. The extension of the first and second spring elements in the direction of the pivot axis is larger than the extension of the torsion element in the direction of the pivot axis.

A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer and a connecting portion. The diaphragm is disposed between the substrate and the back plate and includes a vibration portion. The dielectric layer is formed between the substrate and the diaphragm and has a cavity corresponding to the vibrating portion. The connecting portion is located in the cavity and connects the vibrating portion and the substrate.

Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a rigid plate defining multiple openings that permit passage of a pressure wave. The microelectromechanical microphone device also includes a stiffener member integrated into the rigid plate. The stiffener member causes stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate.