In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

A micromachined gyroscope includes a dynamic mass suspended from at least one anchor attached to a substrate. The dynamic mass includes a first proof mass and a second proof mass, a first drive actuator configured to drive the first proof mass in a first direction in a rotary oscillation mode of the gyroscope, and second drive actuator configured to drive the second proof mass in an opposite direction in the rotary oscillation mode of the gyroscope.

A micro-electro-mechanical system (MEMS) transfer switch is disclosed. The transfer switch comprises a single-pole, N-throw switch section having N selectable switches. Each selectable switch of the N selectable switches has an input, a control terminal and an output. An electrically conductive line is coupled to each of the selectable switches of the N selectable switches. The transfer switch includes a single-pole, M-throw switch section having M selectable switches coupled to the conductive line, each selectable switch of the M selectable switches having an output, a control terminal and an input. The single-pole, N-throw switch section and the single-pole, M-throw switch section are packaged in a single micro-electro-mechanical system (MEMS) die. The N and M are numbers between two and eight and the N selectable switches and the M selectable switches are different switches.

A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmax.sub.x=h*B.sub.x+C.sub.x, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmax.sub.x in the pressure difference transfer function and solving the equation for h, wherein h=(dPtargetC.sub.x)/B.sub.x, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).

A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.

A microelectromechanical vibration and stress isolation system is provided. The system includes an isolation platform configured to support a transducer and having an outer perimeter. A frame surrounds the isolation platform and has inner edge surfaces that are spaced from and face the outer edge surfaces of the platform. A spring connects the isolation platform to the frame. The spring is generally L-shaped, having a first leg that connects one inner edge surface to an outer edge surface while extending around a corner of the platform.

The present disclosure provides a microphone module, an electronic device, and relates to the field of electronic device technology. The microphone module includes a housing, a circuit board, a signal converter, and an adhesive member. The housing is formed with a cavity and an acoustic receiving hole which are connected with each other; the circuit board is connected to the housing to seal a bottom of the cavity; the adhesive member is provided in the cavity; the signal converter for converting an acoustic signal into an electrical signal is electrically connected to the circuit board and provided in the cavity.

Accelerometer including a seismic mass in a plane and a first capacitor plate and a second capacitor plate arranged parallel to the plane. The seismic mass is arranged in between the first capacitor plate and the second capacitor plate. The first capacitor plate and the second capacitor plate are configured to detect movements of the seismic mass out of the plane. A pillar extending from the first capacitor plate to the second capacitor plate through a cut-out in the seismic mass for stiffening the accelerometer.

A microelectromechanical system (MEMS) strain gauge pressure sensor includes a top wafer stack having a top surface and a first cavity that is configured to receive a first fluid at a first pressure, a backing wafer having a bottom surface opposite the top surface of the top wafer stack; a diaphragm wafer positioned between the top wafer stack and the backing wafer and having a second cavity that is configured to receive a second fluid at a second pressure, and a pedestal connected laterally to the top wafer stack, the backing wafer, and the diaphragm wafer. The diaphragm wafer includes a diaphragm extending between the first cavity and the second cavity, and a resistor positioned on the diaphragm. The MEMS strain gauge pressure sensor has a central axis such that the MEMS strain gauge pressure sensor has mechanical symmetries about the central axis.