A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias.

A micromechanical component for a capacitive sensor or switch device, having a substrate having a substrate surface, a diaphragm mounted on the substrate surface having a self-supporting region, at least one lever element and at least one first electrode connected to the at least one lever element. The at least one lever element is connected to the diaphragm in such a way that when there is a warping of the self-supporting region of the diaphragm the at least one lever element is set into a rotational movement, whereby the at least one connected first electrode is set into a first adjustment movement oriented at an angle to the substrate surface. The at least one lever element and the at least one first electrode connected to the at least one lever element are situated between the substrate surface and the diaphragm inner side of the self-supporting region of the diaphragm.

A scanning assembly for an optical instrument includes a reflector and a folded-beam spring assembly coupled to the reflector for deflecting the reflector for beam scanning. A lever suspension assembly is coupled to the folded-beam spring assembly and provides torsional movement of the reflector for beam scanning over a two-dimensional region, allowing for large total scan angles and large vertical displacements.

The improved scanning MEMS mirror device disclosed herein comprises a mirror body that is rotatable around a rotation axis with respect to a stationary body, wherein a rotation of the mirror body is flexibly restrained with at least one coupling element that biases the mirror body towards a neutral state. The coupling element comprises at least a bridge section and a first leaf spring section and a second leaf spring section. The first leaf spring section extends in an extension direction from a first end thereof at the bridge section towards a second end thereof that is connected to the mirror body. The second leaf spring section extends in an extension direction from a first end thereof at the bridge section towards a second end thereof where it is connected to the stationary body. The extension direction of the first leaf spring section and the extension direction of the second leaf spring section are at least substantially the same as the second planar direction. The leaf spring sections have a thickness defined in a direction orthogonal to the reference plane that is smaller than their width, defined in said first planar direction. The construction of the improved scanning MEMS mirror device results in an increased eigenfrequency of undesirable eigenmodes.

A resonator that includes a vibrating portion that has a piezoelectric film, and a lower and upper electrodes that face each other with the piezoelectric film interposed therebetween. Moreover, a holding portion is provided at least around a maximum displacement region of the vibrating portion and has an insulating film. A holding arm connects the vibrating portion and the holding portion, and include a conductive portion that is in contact with the insulating film of the holding portion in at least a region that faces the maximum displacement region of the vibrating portion. In addition, the conductive portion is electrically connected to the lower electrode or the upper electrode or is grounded.

A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

Disclosed herein is a microelectromechanical device that features a fixed structure defining a cavity, a tiltable structure elastically suspended within the cavity, and a piezoelectrically driven actuation structure that rotates the tiltable structure about a first rotation axis. The actuation structure includes driving arms with piezoelectric material, elastically coupled to the tiltable structure by decoupling elastic elements that are stiff to out-of-plane movements but compliant to torsional movements. The tiltable structure is elastically coupled to the fixed structure at the first rotation axis using elastic suspension elements, while the fixed structure forms a frame surrounding the cavity with supporting elements. A lever mechanism is coupled between a supporting element and a driving arm.

This MEMS beam structure that elastically supports a movable section displaced in a first direction includes: a first beam section and a second beam section extending in a second direction orthogonal to the first direction; and a linking section that connects the tip of the first beam section and the tip of the second beam section that is connected to the movable section, wherein the first beam section and the second beam section each have a shape as a beam of uniform strength, and the beam section root of the second beam section is displaced relatively in the first direction with respect to the beam section root of the first beam section according to the displacement of the movable section in the first direction.

A microdevice (100) comprising a movable element (111) capable of moving relative to a fixed part (115), produced in first and second layers of material (104, 106) arranged one above the other such that the movable element comprises a portion (112) of the first layer and a portion (118) of the second layer secured to each other, and wherein the movable element is suspended from the fixed part by a suspension structure (121) formed in the first and/or second layer of material.

A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.