A MEMS device includes an electrical distribution substrate and a spacer ring extending upward therefrom. An actuator stator is positioned above the electrical distribution substrate and within the spacer ring. An outer frame extends from a floor of the actuator stator. An actuator rotor is suspended above the floor. A sensor is supported by the actuator rotor. A conductive stack is positioned above the spacer ring. A wire electrically connects the sensor to the conductive stack. A plurality of vias extending through the spacer ring and to the electrical distribution substrate, thereby allowing electrical communication between the sensor and the electrical distribution substrate while enabling vertical displacement of the sensor and actuator rotor.

A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.

A MEMS device is disclosed. The MEMS device includes a first substrate. At least one structure is formed within the first substrate. The first substrate includes at least one first conductive pad thereon. The MEMS device also includes a second substrate. The second substrate includes a passivation layer. The passivation layer includes a plurality of layers. A top layer of the plurality of layers comprises an outgassing barrier layer. At least one second conductive pad and at least one electrode are coupled to the top layer. At least one first conductive pad is coupled to the at least one second conductive pad.

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

A microelectromechanical system (MEMS) device includes: a mechanical layer; a mirror; and a mirror via coupling the mechanical layer and the mirror. The mirror is laterally offset from the mechanical layer in a direction.

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

A MEMS device includes an electrical distribution substrate and a spacer ring extending upward therefrom. An actuator stator is positioned above the electrical distribution substrate and within the spacer ring. An outer frame extends from a floor of the actuator stator. An actuator rotor is suspended above the floor. A sensor is supported by the actuator rotor. A conductive stack is positioned above the spacer ring. A wire electrically connects the sensor to the conductive stack. A plurality of vias extending through the spacer ring and to the electrical distribution substrate, thereby allowing electrical communication between the sensor and the electrical distribution substrate while enabling vertical displacement of the sensor and actuator rotor.