Disclosed is a peeling method of a cover member including forming a recessed portion that opens one side surface of a substrate, on a region different from a region in which a pattern is formed and forming an opening region including the opening of the recessed portion; attaching the cover member so as to cover the one side surface; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the cover member by attaching the cover member to the substrate to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure.

A process for fabricating a micromechanical structure made of silicon carbide including a cavity, from a stack including a first silicon-carbide layer and a silicon layer on the first silicon-carbide layer, the process including shaping the silicon layer so as to form a discrete silicon structure on the first silicon-carbide layer. The process further includes, after the shaping of the silicon layer, a carbonization to initiate the removal of the discrete silicon structure; depositing a second silicon-carbide layer; and an annealing step, the discrete silicon structure being entirely removed at the end of the annealing.

A MEMS microphone includes a cavity extending portion that increases the size of the cavity. The cavity extending portion can be sloped or stepped in order to create a desired profile of the extended cavity shape. Thus, the volume of the cavity may be increased in order to decrease the compliance and to increase a Signal to Noise Ratio.

In a first aspect, the invention relates to a method for producing a gas-filled reference chamber which is hermetically sealed. Thereby, the gas with which the reference chamber is filled is introduced via an opening in a separate coating chamber only after bonding of the wafers forming the reference chamber. The reference chamber preferably contains MEMS devices.

In another aspect, the invention relates to a photoacoustic gas sensor comprising such a reference chamber within which a MEMS sensor is present.

A microelectromechanical system (MEMS) structure includes at least first and second metal vias. Each of the first and second metal vias includes a respective planar metal layer having a first thickness and a respective post formed from the planar metal layer. The post has a sidewall, and the sidewall has a second thickness greater than 14% of the first thickness.

A method for the production of microfluidic cells using a disc-shaped glass element is provided. The disc-shaped glass element has a thickness of at most 700 micrometers is structured in such a way that it has at least one opening. The opening connects the two opposite-lying, parallel side faces of the glass element. The side faces are attached to a glass part so that the opening is sealed by the two glass parts to form a microfluidic cell having a cavity enclosed therein. The cavity is suitable for the conveyance of fluids. The attachment of the glass element to at least one of the two glass parts is produced by an adhesive that is applied onto the side face of the glass element. During application of the adhesive, the at least one opening in the glass element is left free of adhesive.

The present disclosure relates to an apparatus having a substrate arrangement with a first circuit arrangement that heats up during operation and a second circuit arrangement that is integrated into a substrate material of the substrate arrangement. Further, the apparatus has a cavity structure that is arranged between the first and the second circuit arrangement, said cavity structure being formed in the substrate material and having a pressure that is lower than an ambient atmospheric pressure.

The present disclosure relates to an apparatus having a substrate arrangement with a first circuit arrangement that heats up during operation and a second circuit arrangement that is integrated into a substrate material of the substrate arrangement. Further, the apparatus has a cavity structure that is arranged between the first and the second circuit arrangement, said cavity structure being formed in the substrate material and having a pressure that is lower than an ambient atmospheric pressure. The present disclosure further relates to a method for producing such an apparatus (10).

A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.