A method of manufacturing a microfluidic device comprises molding a substrate using a master die having at least one outer stepped formation; and forming at least one microstructured formation having an outer rim, the depth of the outer rim being shallower than that of the microstructured formation.

A microfluidic device includes a first substrate made of a first polymer material and a second substrate made of a second polymer material, the first and second substrates having respective bonding surfaces, at least one of the bonding surfaces having channel formations so that, when the bonding surfaces are bonded by surface deformation to one another, the bonded first and second substrates and the channel formations form at least part of a microfluidic channel network comprising a plurality of microfluidic channels, wherein one or more indicator pits, separate to the channel formations defining the microfluidic channel network, are formed in at least one of the bonding surfaces, so that surface deformation caused by the bonding process causes a change of configuration of the one or more indicator pits.

The present invention is notably directed to method of fabrication of a microfluidic chip (1), comprising: providing (S1-S7) a substrate (10), a face (F) of which is covered by an electrically insulating layer (30); obtaining (S8) a resist layer (40) covering one or more selected portions (P1) of the electrically insulating layer (30), at least a remaining portion (P2) of said electrically insulating layer (30) not being covered by the resist layer; partially etching (S9) with a wet etchant (E) a surface of the remaining portion (P2) of the electrically insulating layer (30) to create a recess (40r) and/or an undercut (40u) under the resist layer (40); depositing (S10) the electrically conductive layer (50) on the etched surface (35), such that the electrically conductive layer reaches the created recess (40r) and/or undercut (40u); and removing (S11) the resist layer (40) to expose a portion (P1) of the electrically insulating layer adjoining a contiguous portion (P2) of the electrically conductive layer (50). The present invention is further directed to microfluidic chips obtainable by such methods.

Provided are integrated analysis devices having features of macroscale and nanoscale dimensions, and devices that have reduced background signals and that reduce quenching of fluorophores disposed within the devices. Related methods of manufacturing these devices and of using these devices are also provided.

A method for producing MEMS components comprises generating a carrier having a plurality of recesses. An adhesive structure is arranged on the carrier and in the recesses. A semiconductor wafer is generated, which has a plurality of MEMS structures arranged at the first main surface of the semiconductor wafer. The adhesive structure is attached to the first main surface of the semiconductor wafer, with the recesses being arranged above the MEMS structures and the adhesive structure not contacting the MEMS structures. The semiconductor wafer is singulated into a plurality of MEMS components by applying a mechanical dicing process.

A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

A MEMS device and a method of forming the same. A disclosed method includes: providing a silicon substrate layer, a buried oxide layer and a device silicon layer; using a microfabrication process to pattern a set of device features on the device silicon layer including a shuttle mass and an anchor frame; removing the silicon substrate layer and buried oxide below the shuttle mass; placing a shadow mask on a surface of the device silicon layer, wherein the shadow mask has an microscale opening to expose at least one device feature; and forming a nanoscale stopper on a sidewall of the at least one device feature by depositing a deposition material through the opening in a controlled manner.

A microfluidic device includes first and second outer layers each having one or more microfluidic formations and an intermediate layer bonded between the first and second outer layers; in which the glass transition temperature of the first outer layer is higher than the glass transition temperature of the second outer layer.

Microfluidics has advanced in terms of designs and structures, however, fabrication methods are either time consuming or expensive to produce, in terms of the facilities and equipment needed. A fast and economically viable method is provided to allow, for example, research groups to have access to microfluidic fabrication. Unlike most fabrication methods, a method is provided to fabricate a microfluidic device in one step. In an embodiment, a resolution of 50 micrometers was achieved by using maskless high-resolution digital light projection (MDLP). Bonding and channel fabrication of complex or simple structures can be rapidly incorporated to fabricate the microfluidic devices.

A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.