A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

Three-dimensional microstructure devices having substantially perfect alignment and leveling of a three-dimensional microstructure with respect to a substrate having a plurality of discrete electrodes and relating fabricating methods are disclosed. Seed layers are deposited onto the discrete electrodes of the substrate, and the three-dimensional microstructure is bonded adjacent to the seed layers. A substantially uniform sacrificial layer is deposited onto exposed surfaces of the three-dimensional microstructure. A plurality of first gaps exists between the seed layers and corresponding regions of the sacrificial layer. Conductive layers are deposited to fill the first gaps. The sacrificial layer is dissolved to create a second plurality of gaps between the conductive layers and the corresponding regions of the three-dimensional microstructure. The second gaps are substantially uniform.

Three-dimensional micro devices usable as electromagnetic and magnetomechanical energy converters, as micromagnetic motors or generators, and methods for their production. The three-dimensional micro devices exhibit high efficiency even at dimensions on the microscale and below, and the method for production, as well as mass production, is simple and economical. Moreover, the three-dimensional micro devices at least include one three-dimensional device produced using roll-up technology. This three-dimensional device includes all functional and structural components for full functionality. At least one functional or structural component is an element that is at least partially freely movable at least partially within a surrounding element and is arranged such that it can be rotated at least around one of its axes.

A method includes depositing a silicon layer over a first oxide layer that overlays a first silicon substrate. The method further includes depositing a second oxide layer over the silicon layer to form a composite substrate. The composite substrate is bonded to a second silicon substrate to form a micro-electro-mechanical system (MEMS) substrate. Holes within the second silicon substrate are formed by reaching the second oxide layer of the composite substrate. The method further includes removing a portion of the second oxide layer through the holes to release MEMS features. The MEMS substrate may be bonded to a CMOS substrate.

Various embodiments of the present disclosure are directed towards a semiconductor structure comprising a spring structure. A first substrate underlies a second substrate. The first and second substrates at least partially define a cavity. A microelectromechanical systems (MEMS) component is arranged in the cavity. The spring structure is disposed between a region of the second substrate and the MEMS component. The spring structure comprises a first layer and a second layer. The first layer continuously extends along a first vertical surface of the second layer.

The method for drawing a fiber with a textured surface comprises the following steps: forming of a preform from which the fiber is to be drawn with a textured surface; addition of an outer layer to the textured preform to preserve the shape of the texture of the preform surface during the drawing operation; drawing of a fiber from the preform, whereby the fiber keeps the formed texture of the preform surface andremoving the additional outer layer to leave the original surface textured fiber exposed. The obtained fiber can be used as a mold to form a textured hollow channel in another material, as a surface coating and as a pressure detector.

Systems and methods for multi-sensor integrated sensor devices are provided. In one embodiment, a sensor device comprises: a substrate having a first surface and an opposing second surface; a plurality of sensor cavities recessed into the substrate; a first sensor die sealed within a first sensor cavity of the plurality of sensor cavities at a first atmospheric pressure level; a second sensor die sealed within a second sensor cavity of the plurality of sensor cavities at a second atmospheric pressure level that is a different pressure than the first atmospheric pressure level; a first plurality of direct feedthrough electrical conductors embedded within the substrate coupled to the first sensor die; and a second plurality of direct feedthrough electrical conductors embedded within the substrate coupled to the second sensor die.

In one approach, a method of fabricating radiation detection devices includes: forming a structural layer overlying a frontside of a substrate; forming a metallic layer overlying the structural layer; releasing each of a plurality of devices on the substrate by etching a backside of the substrate, wherein each device comprises a plate and legs attached to the plate, the legs comprising at least a portion of the metallic layer; and sealing each of the plurality of devices, the sealing comprising: attaching a transparent cavity cap to the frontside of the substrate; and attaching a radiation-transparent substrate to the backside of the substrate.

A method and apparatus are provided to prevent or reduce stiction of a MEMS device. The MEMS device may include a protrusion extending from a surface of the MEMS device. During manufacture, the protrusion may be connected across an opening in the MEMS device to a sidewall of the substrate. Before manufacture of the MEMS device is completed, at least a portion of the protrusion connecting the MEMS device to the substrate may be removed. During operation, the protrusion may provide stiction prevention or reduction for the surface from which the first protrusion may extend. A plurality of protrusions may be formed along a plurality of surfaces for the MEMS device to prevent or reduce stiction along the corresponding surfaces. Protrusions may also be formed on devices surrounding or encapsulating the MEMS device to prevent or reduce stiction of the MEMS device to the surrounding or encapsulating devices.

In one approach, a method of fabricating radiation detection devices includes: forming a structural layer overlying a frontside of a substrate; forming a metallic layer overlying the structural layer; releasing each of a plurality of devices on the substrate by etching a backside of the substrate, wherein each device comprises a plate and legs attached to the plate, the legs comprising at least a portion of the metallic layer; and sealing each of the plurality of devices, the sealing comprising: attaching a transparent cavity cap to the frontside of the substrate; and attaching a radiation-transparent substrate to the backside of the substrate.