A MEMS package structure and a method for manufacturing same. The MEMS package structure comprises a MEMS die (200) and a device wafer (100). The MEMS die (200) has micro-cavities (211, 221) and contact pads (212, 222) configured to be coupled to an external electrical signal. The micro-cavity (221) of the MEMS die (200) has an opening (221a) in communication with the outside. The device wafer (100) is provided therein with a control unit corresponding to the MEMS die (200). An interconnection structure (300) is provided in the device wafer (100) and is electrically connected to each of the contact pads (212, 222) and the control unit. A rewiring layer (400) electrically connected to the interconnection structure (300) is provided on a second surface of the device wafer (100). The provision of the MEMS die (200) and the rewiring layer (400) respectively on both sides of the device wafer is conductive to reducing the size of the MEMS package structure; various MEMS dies can be integrated on one device wafer, thereby meeting the requirements for the function integration capability of the MEMS package structure in practical application.

A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

A micromechanical sensor, including a micromechanical chip having a first micromechanical structure, a first evaluation chip, having a first application-specific integrated circuit, and a second evaluation chip having a second application-specific integrated circuit. The first evaluation chip and the micromechanical chip are situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip and the first evaluation chip being directly electrically conductively connected with the second evaluation chip. The first application-specific integrated circuit primarily includes analog circuit elements and the second application-specific circuit primarily includes digital circuit elements.

A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

The integrated CMOS-MEMS device includes a CMOS structure, a cap structure, and a MEMS structure. The CMOS structure, fabricated on a first substrate, includes at least one conducting layer. The cap structure, including vias passing through the cap structure, has an isolation layer deposited on its first side and has a conductive routing layer deposited on its second side. The MEMS structure is deposited between the first substrate and the cap structure. The integrated CMOS-MEMS device also includes a conductive connector that passes through one of the vias and through an opening in the isolation layer on the cap structure. The conductive connector conductively connects a conductive path in the conductive routing layer on the cap structure with the at least one conducting layer of the CMOS structure.

A manufacturing method for a micromechanical component. The method includes: providing an ASIC component including first front and rear sides, a strip conductor unit being provided at the first front side; providing a MEMS component including second front and rear sides, a micromechanical functional element situated in a cavity at the second front side; bonding the first front side onto the second front side; back-thinning the first rear side; forming vias starting from the back-thinned first rear side and from a redistribution unit on the first rear side, the vias electrically connecting the strip conductor unit to the redistribution unit; forming electrical contact elements on the redistribution unit; and back-thinning the second rear side. The back-thinning of the first and second rear side taking place so that a thickness of the stack made up of ASIC component and MEMS component is less than 300 micrometers.

The present invention relates to a sensor arrangement, to a corresponding method of assembling such a sensor arrangement, and to a sensor system. The sensor arrangement comprises at least one transducer element for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; and a sensor substrate comprising the transducer element. The sensor substrate is mountable on a circuit carrier in a way that a media channel penetrating the circuit carrier allows access of the at least one measurand to the transducer element. The circuit carrier has an electrically conductive solderable first sealing pattern which surrounds the media channel at least partly and which is aligned with a solderable second sealing pattern arranged on the sensor substrate, so that a soldered sealing connection, which at least partly surrounds the media channel, is formed between the first sealing pattern and the second sealing pattern.

An MEMS microphone comprises a substrate; a cover covering the substrate and forming an acoustic cavity with the substrate, wherein the substrate of the acoustic cavity is provided with: an acoustic transducer disposed in a first region of the substrate; an integrated circuit chip comprising a first bonding pad and a second bonding pad, wherein the first bonding pad is connected to the acoustic transducer via lead wires, the second bonding pad communicates with a groove formed at a bottom of the integrated circuit chip; a metal connection layer is formed on a surface of the groove and a portion where the metal connection layer extends to a bottom surface of the integrated circuit chip serves as a metal connection area. The integrated circuit chip is connected to a second region of the substrate through the metal connection area.

A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.