A MEMS anti-phase vibratory gyroscope includes two measurement masses with a top cap and a bottom cap each coupled with a respective measurement mass. The measurement masses are oppositely coupled with each other in the vertical direction. Each measurement mass includes an outer frame, an inner frame located within the outer frame, and a mass located within the inner frame. The two measurement masses are coupled with each other through the outer frame. The inner frame is coupled with the outer frame by a plurality of first elastic beams. The mass is coupled with the inner frame by a plurality of second elastic beams. A comb coupling structure is provided along opposite sides of the outer frame and the inner frame. The two masses vibrate toward the opposite direction, and the comb coupling structure measures the angular velocity of rotation.

A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.

The present application provides the block copolymers and their application. The block copolymer has an excellent self assembling property and phase separation and various required functions can be freely applied thereto as necessary.

A system, multifunctional chip, and fabrication method thereof are provided. For example, a method for use in fabricating an opto-electromechanical system includes generating, from a film of a material and a substrate on which the film is disposed, a suspended portion of the film by removing a first portion of the substrate such that the film's first portion becomes the suspended portion and a second portion of the film is adjacent to a second portion of the substrate after removing the substrate's first portion. A two-dimensional nanomaterial is thereafter transferred onto a section of the suspended portion of the film via an all-dry process. A cantilever is thereafter generated from the film's suspended portion and extends from the film's second portion. The two-dimensional nanomaterial is disposed on the cantilever. Other aspects and features are also claimed and described.

A device is provided that includes a stator including a stator element and a row of stator comb fingers, wherein the stator comb fingers extend away from the stator element in a y-direction. A device may include a rotor including a rotor element and a row of rotor comb fingers, wherein the rotor comb fingers extend away from the rotor element in a direction which is opposite to the y-direction, and wherein the stator comb fingers are interdigitated with the rotor comb fingers, and form an interdigitated row, and each pair of adjacent stator comb finger and rotor comb finger are separated from each other by a x-gap in a x-direction, which is perpendicular to the y-direction.

A structured membrane fabrication method begins with a membrane wafer on a substrate and at least one thin-film on the membrane wafer such that portions of the membrane wafer are exposed. The exposed portions of the membrane wafer and each thin-film are covered with an acetone-inert protectant. Portions of the protectant are etched through to the membrane wafer while each thin-film remains fully covered by the protectant. A handle is coupled to the protectant with a wax that dissolves in acetone. Portions of the substrate are then removed to define and expose a contiguous region of the membrane wafer adjacent to each thin-film and the portions of the protectant so-etched. The wax is exposed to acetone so that it dissolves. The contiguous region of the membrane wafer is then etched through at the portions of the protectant so-etched. The protectant is then removed.

Systems, processes and devices are provided for laser-based manufacturing of resonators and MEMS devices from bulk material including optically transparent material. Processes include digital marking of resonator structures in bulk material through non-linear interaction of ultrafast laser beam inscribing and material. The resonator structure may be defined and released through selective wet etching of the laser-modified areas, utilizing a combination of basic and acidic aqueous solutions. Processes can also include hydrofluoric thinning prior to wet etching to prevent laser surface damages. Systems and processes can pattern and fabricate resonator structures and concentricring structures. Embodiments provide miniaturized vibratory sensors from low loss material, such as fused silica and quartz, with an improved resolution and accuracy of measurements for inertial sensing, time referencing, bio-sensing and acoustic sensing.

A product includes an elongated carbon-containing pillar having a bottom and a tip opposite the bottom. The width of the pillar measured 1 nm below the tip is less than 700 nm. A method includes masking a carbon-containing single crystal for defining masked regions and unmasked regions on the single crystal. The method also includes performing a plasma etch for removing portions of the unmasked regions of the single crystal, thereby defining a pillar in each unmasked region, and performing a chemical etch on the pillars at a temperature between 1200 C. and 1600 C. for selectively reducing a width of each pillar.

A method of manufacturing a pressure sensor is provided. The method includes: providing a substrate, wherein a bottom electrode and a pressure sensing film are disposed on the substrate; forming an etch stop assembly on the pressure sensing film at a location corresponding to a pressure trench; forming a cover layer on the substrate covering the etch stop assembly and the pressure sensing film; forming a mask layer on the cover layer, wherein an opening of the mask layer is formed above the etch stop assembly and exposes a portion of the cover layer at the location corresponding to the pressure trench; etching the cover layer using the mask layer so as to form the pressure trench in the cover layer; removing the etch stop assembly at a bottom of the pressure trench; and removing the mask layer.

A method creates MEMS structures by selectively etching a silicon wafer that is patterned by using a masking layer. The method comprises depositing and patterning a first mask on a silicon wafer to define desired first areas on the wafer to be etched. First trenches are etched on parts of the wafer not covered by the first mask. The first trenches are filled with a deposit layer. A part of the deposit layer is removed on desired second areas to be etched and a remainder is left on areas to function as a second mask to define final structures. Parts of the wafer on the desired second areas is etched, and the second mask is removed. A gyroscope or accelerator can be manufactured by dimensioning the structures.