A process for the formation of a graphene membrane component includes arranging a graphene membrane in a relaxed condition of the graphene membrane on a surface of a supportive substrate. The graphene membrane extends across a cut-out with an opening at the surface of the supportive substrate. The graphene membrane is moreover arranged so that a first portion of the graphene membrane is arranged on the surface of the supportive substrate and a second portion of the graphene membrane is arranged over the opening of the cut-out. The process further includes tensioning of the second portion of the graphene membrane, in order to convert the second portion of the graphene membrane to a tensioned condition, so that the second portion of the graphene membrane is permanently in the tensioned condition in an operating temperature range of the graphene membrane component.

A semiconductor device includes a substrate having an opening extending through the substrate and at least one support member on a sidewall of the opening, a vibration membrane on the substrate, a cover layer on the vibration membrane. The substrate, the vibration membrane, and the cover layer define a cavity. The opening exposes a lower surface portion of the vibration membrane. The at least one support member on the sidewall of the opening provides support to the vibration membrane in a deformation of the vibration membrane to prevent breakage.

A method for manufacturing a MEMS device includes forming a first solid body by forming, on a substrate, a layered structure having a thickness of a value comprised between 4 and 10 ?m, with the layered structure having a first surface that is uniformly flat or planar throughout the extension thereof that faces the substrate. The method further includes forming, on a second surface of the layered structure opposite to the first surface in a direction, multiple transducer devices. The method then proceeds with coupling the first solid body to a supporting structure, and completely removing the substrate to expose said uniformly flat or planar surface.

The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

A microphone includes a substrate, an opening in the substrate, and a support structure in the opening. The support structure includes a first bracket formed in a closed-loop pattern and a second bracket connecting the first bracket to a periphery of the opening. The support structure in the opening increases the mechanical reliability of the microphone.

A process for the formation of a graphene membrane component includes arranging a graphene membrane in a relaxed condition of the graphene membrane on a surface of a supportive substrate. The graphene membrane extends across a cut-out with an opening at the surface of the supportive substrate. The graphene membrane is moreover arranged so that a first portion of the graphene membrane is arranged on the surface of the supportive substrate and a second portion of the graphene membrane is arranged over the opening of the cut-out. The process further includes tensioning of the second portion of the graphene membrane, in order to convert the second portion of the graphene membrane to a tensioned condition, so that the second portion of the graphene membrane is permanently in the tensioned condition in an operating temperature range of the graphene membrane component.

A micro-electromechanical system (MEMS) device includes a movable comb structure located in a cavity within an enclosure, and a stationary structure affixed to the enclosure. The movable comb structure includes a comb shaft portion and movable comb fingers laterally protruding from the comb shaft portion. The movable comb structure includes a metallic material portion. The movable structure and the stationary structure are configured to generate an electrical output signal based on lateral movement of the movable structure relative to the stationary structure.

A micro-electromechanical system (MEMS) device includes a movable comb structure located in a cavity within an enclosure, and a stationary structure affixed to the enclosure. The movable comb structure includes a comb shaft portion and movable comb fingers laterally protruding from the comb shaft portion. The movable comb structure includes a metallic material portion. The movable structure and the stationary structure are configured to generate an electrical output signal based on lateral movement of the movable structure relative to the stationary structure.

A micro electro-mechanical system (MEMS) acoustic sensor is disclosed. The acoustic sensor comprises a backplate and a diaphragm. The acoustic sensor further comprises a flexible member and optional spacer member disposed between the backplate and the diaphragm resulting in a gap between the backplate and the diaphragm. The gap can vary in response to impinging pressure on the diaphragm based on the design of the flexible member and resulting in a variable capacitance between the backplate and the diaphragm. The change in the gap can result in a change in an electrical characteristic associated with the variable capacitance and can be converted to an electrical output signal corresponding to the impinging pressure on the diaphragm. The flexible member can be part of the backplate or diaphragm.

A MEMS component. The MEMOS component includes a micromechanical membrane spring including first and second membrane spring elements with an at least regional two-dimensional curvature. The first membrane spring element is mechanically coupled to the second membrane spring element such that a resulting spring force of the membrane spring is imparted by the first and second membrane spring elements. The membrane spring is integrated into a layer structure of the MEMS component such that the resulting spring force of the membrane spring acts substantially in the layer sequence direction of the layer structure. A device for preloading the membrane spring is configured to set an operating point of the membrane spring with respect to the spring characteristic curve using permanent elastic deflection of the membrane spring, such that the operating point is in an approximately linear spring characteristic curve range of the membrane spring with a slight gradient.