A microelectronic device includes a copper structure over an electronic component. The copper structure includes copper having an average grain size greater than 1 micron. The copper structure has a corrosion barrier, which includes primarily cuprous oxide, directly on the copper. The corrosion barrier is exposed at an exterior surface. The microelectronic device is formed by plating copper over a substrate of the microelectronic device. The copper structure with the corrosion barrier is annealed at a temperature of 125 C. to 200 C. in a non-reducing ambient.

A micromirror array is provided having a mirror membrane, including a first supporting element, including for each first supporting element, a first coupling element that is located between the mirror membrane and the particular first supporting element and is formed to mechanically couple the particular first supporting element to the mirror membrane; having at least one second supporting element that is mechanically coupled to the at least one first supporting element; and having a second coupling element for each second supporting element that is formed to be mechanically contacted. Also a method for manufacturing a micromirror array according to the present inventions described.

A MEMS device and a method for manufacturing a MEMS device are disclosed. In an embodiment the MEMS device comprises a support having a cavity therethrough and a membrane extended over the cavity of the support, wherein the membrane is at least partially reinforced by graphene.

A microelectromechanical system (MEMS) mirror device includes a frame that defines a frame cavity; a suspension assembly; and a mirror body coupled to the frame by the suspension assembly such that the mirror body is suspended over the frame cavity. The mirror body comprises a sandwich structure that includes a front plate, a back plate, and a hollow core assembly arranged between the front plate and the back plate. The front plate and the back plate define a thickness dimension of the mirror body. The hollow core assembly includes a plurality of support structures that extend between the front plate and the back plate and define a plurality of cavities between the front plate and the back plate.

An apparatus, system, and method for micro-electro-mechanical system (MEMS) micromirror including a plurality of stiffening structures is described. The MEMS micromirror includes a mirror surface to reflect light, a support platform coupled along a mirror surface, and a plurality of stiffening structures formed from or coupled to the support platform. In some examples, a dimensionality or density of the stiffening structures scale across an area of the support platform in a manner to assist in keeping the mirror surface flat under torsional force.

According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.

A microelectromechanical device includes: a supporting body, containing semiconductor material; a movable mass, constrained to the supporting body with a relative degree of freedom with respect to a first motion direction perpendicular to the supporting body; and at least one stopping structure, configured to limit out-of-plane movements of the movable mass along the first motion direction. The stopping structure includes: first elements, extending parallel to the first motion direction and anchoring the stopping structure to the supporting body; and a second element, extending transversally to the first elements, surmounting and connecting the first elements.

MEMS device and manufacturing method therefor. The device includes a base; a diaphragm including an upper part and a lower part, a receiving space being formed therebetween; a counter electrode located in the receiving space; and support members located between the two parts, spaced apart from one another and from the counter electrode, two ends of each support member being connected to the two parts, respectively. The diaphragm includes a first zone and a second zone. In the first zone, a surface of the upper part is covered with a first electrode, a surface of the lower part is covered with a second electrode opposite to the first electrode. In the second zone, a surface of the upper part and a surface of the lower part are each covered with a reinforcement layer. The reinforcement layer in the second zone enhances the mechanical strength and robustness of the diaphragm.

Microelectromechanical systems (MEMS) apparatuses and processes are described that can employ a spring pillar or flexible pillar coupled to a sensing membrane to enhance deformation of the sensing membrane while providing robust MEMS sensors or devices. Described MEMS sensors or devices can comprise an exemplary spring pillar or flexible pillar between the sensing membrane structure and the backplate structure. Exemplary spring pillar or flexible pillar can facilitate adjusting stiffness of the sensing membrane to provide MEMS sensors or devices having large sensing area and compact device size.

A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region, elastically suspended above the cavity and having a main extension in a horizontal plane; at least one first pair of driving arms, carrying respective piezoelectric structures which can be biased to generate a driving force that causes rotation of the tiltable structure about a rotation axis parallel to a first horizontal axis of the horizontal plane; elastic suspension elements, which elastically couple the tiltable structure to the fixed structure at the rotation axis and are rigid to movements out of the horizontal plane and compliant to torsion about the rotation axis. In particular, the driving arms of the first pair are magnetically coupled to the tiltable structure to cause its rotation about the rotation axis by magnetic interaction, following biasing of the respective piezoelectric structures.