A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.

An assembly of metallic MEMS structures directly fabricated on planarized CMOS substrates, containing the application-specific integrated circuit (ASIC), by direct deposition and subsequent microfabrication steps on the ASIC interconnect layers, with integrated capping for packaging, is provided. The MEMS structures comprise at least one MEMS device element, with or without moveable parts anchored on the CMOS ASIC wafer with electrical contact provided via the metallic interconnects of the ASIC. The MEMS structures can also be made of metallic alloys, conductive oxides and amorphous semiconductors. The integrated capping, which provides a sealed cavity, is accomplished through bonding pads defined in the post-processing of the CMOS substrate.

Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a CMOS substrate and a MEMS substrate bonded with the CMOS substrate. The CMOS substrate includes a semiconductor substrate, a first dielectric layer formed over the semiconductor substrate, and a plurality of conductive pads formed in the first dielectric layer. The MEMS substrate includes a semiconductor layer having a movable element and a second dielectric layer formed between the semiconductor layer and the CMOS substrate. The MEMS substrate also includes a closed chamber surrounding the movable element. The MEMS substrate further includes a blocking layer formed between the closed chamber and the first dielectric layer of the CMOS substrate. The blocking layer is configured to block gas, coming from the first dielectric layer, from entering the closed chamber.

A production method for a micromechanical sensor component and a corresponding micromechanical sensor component. The production method includes: providing a sensor wafer with a plurality of micromechanical sensor chips, which include one or more relevant sensor regions; forming an access wafer with one or a corresponding plurality of access chips, which in each case include one or more access regions to the sensor regions, which form relevant media access regions for the sensor regions; attaching the access wafer to the sensor wafer, so that the access regions are arranged above the corresponding sensor region(s); and separating the sensor chips with the access chips glued thereon, in order to obtain a plurality of sensor component chips.

A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.

A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.

A micromechanical component and a corresponding production method. The micromechanical component is equipped with a substrate, a function chip which is attached to the substrate and has a main surface facing away from the substrate, wherein one or more bond pads are provided on the main surface, which are bonded to the substrate by a respective bond wire. On the main surface or above the main surface of the function chip, a cover chip, which is formed from a chip material that has a diffusion-inhibiting effect on halogen ions located in the mold compound, is attached as a diffusion barrier to a mold package. The cover chip covers the main surface substantially completely. The micromechanical component further includes the mold package, in which the function chip is packaged together with the cover chip.

A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first substrate and the second substrate, and where the metallic layer includes a sloped edge that contacts the first substrate within the cavity.

According to some implementations, a device is provided, including: a base element, a MEMS sensor provided on the base element, and at least one bond wire electrically coupling the MEMS sensor to the base element. The device further includes a protective coating covering the MEMS sensor, the at least one bond wire and at least part of the base element, and a gel provided on the protective coating.

In an embodiment, a MEMS device includes a functional element in a fluidic connection with an environment, wherein the functional element comprises an overall surface area with at least a first subsection and an adjacent second subsection, wherein the functional element is in the first subsection of the overall surface area less prone to a surface contamination than in the second subsection of the overall surface area, and wherein the first subsection of the overall surface area has a first surface structure with a higher liquid wettability than a second surface structure of the second subsection of the overall surface area.