Materials and methods for mitigating the effects of halide species contained in process streams are provided. A halide-containing process stream can be contacted with mitigation materials comprising active metal oxides and a non-acidic high surface area carrier combined with a solid, porous substrate. The halide species in the process stream can be reacted with the mitigation material to produce neutralized halide salts and a process stream that is essentially halide-free. The neutralized salts can be attracted and retained on the solid, porous substrate.

Disclosed herein is a composite material formed from an inorganic mesoporous, or mesoporous-like, material that is dispersed throughout a polymeric matrix formed by a crosslinked polymer that has acidic- or basic-residues and which may also optionally have further acidic- or basic-residues grafted onto the inorganic mesoporous material. The resulting composite material may be used to remove acidic or basic impurities from a gas in need thereof and can be easily regenerated.

Disclosed is a process for treating a gas stream containing hydrochloric acid, hydrofluoric acid, a fluorinated compound and halogenated organic compounds, wherein the gas stream is subjected to: (a) a step of washing with an acid solution to obtain a washed gas stream; (b) a step of adiabatic absorption in an aqueous solution of the hydrochloric acid contained in said washed gas stream, to collect a solution of hydrochloric acid; (c) a step of adsorption on activated carbon of the impurities present in said hydrochloric acid solution, to obtain a purified hydrochloric acid solution and a gas stream containing said fluorinated compound; and (d) a step of bringing said purified hydrochloric acid solution into contact with a silica gel. Also disclosed is a plant for the implementation of this process, and also a process for preparing a fluorinated compound comprising the catalytic pyrolysis of an organofluorine compound.

A sorbent in the form of a layered, non-porous perovskite is provided, wherein the sorbent can include parallel, alternating layers of an organic layer, including an ordered array of organic moieties capable of reacting with a gaseous halogen, and an inorganic layer, including a metal-halide sheet. Furthermore, each organic layer can be sandwiched between inorganic layers. Methods for capturing one or more halogens from a gas stream are also provided, wherein the methods can include contacting a gas stream with a sorbent in the form of a layered, non-porous perovskite, wherein the sorbent can include parallel, alternating layers of an organic layer, including an ordered array of organic moieties capable of reacting with a gaseous halogen, and an inorganic layer, including a metal-halide sheet. One or more halogens in the gas stream can react with either alkyne groups or alkene groups found in the organic layer of the sorbent.

Materials and methods for mitigating the effects of halide species contained in process streams are provided. A halide-containing process stream can be contacted with mitigation materials comprising active metal oxides and a non-acidic high surface area carrier combined with a solid, porous substrate. The halide species in the process stream can be reacted with the mitigation material to produce neutralized halide salts and a process stream that is essentially halide-free. The neutralized salts can be attracted and retained on the solid, porous substrate.

An injection lance assembly for creating a higher degree of turbulence and dispersion of a treating agent into a fluid stream.

A gas laser apparatus may include: a laser chamber connected through a first control valve to a first laser gas supply source that supplies a first laser gas containing a halogen gas and connected through a second control valve to a second laser gas supply source that supplies a second laser gas having a lower halogen gas concentration than the first laser gas; a purification column that removes at least a part of the halogen gas and a halogen compound from at least a part of a gas exhausted from the laser chamber; a booster pump, connected through a third control valve to the laser chamber, which raises a pressure of a gas having passed through the purification column to a gas pressure that is higher than an operating gas pressure of the laser chamber; and a controller that calculates, on a basis of a first amount of a gas supplied from the booster pump through the third control valve to the laser chamber, a second amount of the first laser gas that is to be supplied to the laser chamber and controls the first control valve on a basis of a result of the calculation of the second amount.

A gas laser apparatus may include: a laser chamber connected through a first control valve to a first laser gas supply source that supplies a first laser gas containing a halogen gas and connected through a second control valve to a second laser gas supply source that supplies a second laser gas having a lower halogen gas concentration than the first laser gas; a purification column that removes at least a part of the halogen gas and a halogen compound from at least a part of a gas exhausted from the laser chamber; a booster pump, connected through a third control valve to the laser chamber, which raises a pressure of a gas having passed through the purification column to a gas pressure that is higher than an operating gas pressure of the laser chamber; and a controller that calculates, on a basis of a first amount of a gas supplied from the booster pump through the third control valve to the laser chamber, a second amount of the first laser gas that is to be supplied to the laser chamber and controls the first control valve on a basis of a result of the calculation of the second amount.

A gas laser apparatus may include: a laser chamber connected through a first control valve to a first laser gas supply source that supplies a first laser gas containing a halogen gas and connected through a second control valve to a second laser gas supply source that supplies a second laser gas having a lower halogen gas concentration than the first laser gas; a purification column that removes at least a part of the halogen gas and a halogen compound from at least a part of a gas exhausted from the laser chamber; a booster pump, connected through a third control valve to the laser chamber, which raises a pressure of a gas having passed through the purification column to a gas pressure that is higher than an operating gas pressure of the laser chamber; and a controller that calculates, on a basis of a first amount of a gas supplied from the booster pump through the third control valve to the laser chamber, a second amount of the first laser gas that is to be supplied to the laser chamber and controls the first control valve on a basis of a result of the calculation of the second amount.

A gas laser apparatus may include: a laser chamber connected through a first control valve to a first laser gas supply source that supplies a first laser gas containing a halogen gas and connected through a second control valve to a second laser gas supply source that supplies a second laser gas having a lower halogen gas concentration than the first laser gas; a purification column that removes at least a part of the halogen gas and a halogen compound from at least a part of a gas exhausted from the laser chamber; a booster pump, connected through a third control valve to the laser chamber, which raises a pressure of a gas having passed through the purification column to a gas pressure that is higher than an operating gas pressure of the laser chamber; and a controller that calculates, on a basis of a first amount of a gas supplied from the booster pump through the third control valve to the laser chamber, a second amount of the first laser gas that is to be supplied to the laser chamber and controls the first control valve on a basis of a result of the calculation of the second amount.